Technology Available

Request More Information


  • 3322
  •  Multiple Electron-Beam Writing to Mask and Wafer
  •  Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during exposure.
  • This request will be submitted to Tynax. Please provide information about yourself, let us know what additional information you would like, and how we can help you.