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Tynax ~ Patent Library

Technology Wanted

Semiconductor IC Package Assembly Equipment Designs and Technology Sought

Automated equipment designed for processing or manufacturing of IC package assembly

Overview

Automated equipment designed for processing or manufacturing of IC package assembly in the areas of:

- package molding

- wire bonding

- trim and form

- wafer sawing

- die sorting

- singulation

The equipment prototypes should be production ready, with completed field trials

Patents and Intellectual Property

We will consider technology not covered by a patent.

Countries we would like patent coverage in: US, China, Taiwan, Japan, Korea, Singapore.

Due Dates for Proposals and Responses

By Q3, 2012