Technology WantedSemiconductor IC Package Assembly Equipment Designs and Technology Sought
Automated equipment designed for processing or manufacturing of IC package assembly
Automated equipment designed for processing or manufacturing of IC package assembly in the areas of:
- package molding
- wire bonding
- trim and form
- wafer sawing
- die sorting
The equipment prototypes should be production ready, with completed field trials
Patents and Intellectual Property
We will consider technology not covered by a patent.
Countries we would like patent coverage in: US, China, Taiwan, Japan, Korea, Singapore.
Due Dates for Proposals and Responses
By Q3, 2012