Patent for License:Apparatus for electro-chemical deposition with thermal anneal chamber
SUMMARY OF THE TECHNOLOGY
The technology generally provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs rules and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, a rapid thermal anneal chamber disposed adjacent the loading station, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a system controller adapted to control the electro-chemical deposition process and the components of the electro-chemical deposition system, including the rapid thermal anneal chamber disposed adjacent the loading station.
One aspect of the technology provides an electro-chemical deposition system that provides uniform power distribution and current density across the substrate plating surface to form a metal layer having uniform thickness and maintain a vacuum condition which secures the substrate to the substrate holder during processing.
Another aspect of the technology provides an electro-chemical deposition system that prevents and/or remove unwanted edge and backside deposition to control contamination to the substrate being processed as well as subsequent substrates.
Yet another aspect of the technology provides a post electro-chemical deposition treatment, such as a rapid thermal anneal treatment, for enhancing deposition results. The apparatus for rapid thermal anneal treatment preferably comprises a rapid thermal anneal chamber disposed adjacent the loading station of the electrochemical deposition system.
Class 204: Chemistry: Electrical And Wave Energy
This class includes, where not provided for elsewhere: A. Processes (1) involving the use of electrolysis (as provided for in Class 205); (2) of preparing or purifying compounds or elements involving chemical reaction brought about by electrical or wave energy in a magnetic field; (3) of treating materials involving chemical reaction brought about by wave energy; (4) of preparing or purifying compounds or elements involving chemical reaction brought about by an electrostatic field or electrical discharge; (5) involving the use of electrophoresis or electro-osmosis; (6) of treating a liquid (a) to separate or purify the liquid using electric and magnetic fields simultaneously, (b) to separate or purify the liquid using an electric field, or (c) using a magnetic field to obtain some effect other than mere separation or purification of the liquid; (7) involving coating, forming, or etching by the use of sputtering; and (8) involving coating by the use of vacuum arc discharge.Subclass 198: Work conveyer
Subclass 241: With heater or cooler
Subclass 269: With feeding and/or withdrawal means
Subclass 270: Gas