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Patent for Sale:

Methods for Transfer of Semiconductor Die, Including LEDs    

The patented technology provides methods for removal and transfer of semiconductor die from a host substrate to a target substrate.

Overview

Many semiconductor packaging approaches require the removal of a chip from a host substrate and transfer of that chip from the host substrate to a target substrate. Such packaging approaches include flip chip and chip on board technologies, among others. These approaches are used for electronic devices, for example integrated circuits, as well as optical devices such as LEDs, detectors and solar cells.

The available technology includes two patents. The first focuses on methods of making a transferable chip, including the use of a radiation-enhanced lift-off layer that is weakened by irradiation through a substrate transparent to that radiation. The chip, while attached to the host substrate, is adhered to a target substrate, irradiated through the host substrate to weaken the radiation enhanced lift-off layer and then separated from the host substrate.

The second patent focuses on methods of transferring semiconductor die from a host substrate to a target substrate using a selectively formed electrostatic charge to temporarily adhere the die to a transfer substrate, transferring the die to a target substrate and releasing the die from the transfer substrate to the target substrate. The die may also be transferred directly to the target substrate, without the use of a transfer substrate.

Primary Application of the Technology

The target markets for the technology are any semiconductor applications that use or may use chip on board or flip chip technology. Such applications may include electronic devices where space is at a premium, for example mobile phones, tablets, music devices, RFID and LEDs. In the case of LEDs, the technology is applicable to InGaAlP and GaN-based devices.

Competitive Advantage

The key benefits of these packaging approaches are reduced cost, simplified bill of materials and lower volume, particularly lower height, packaging. In the case of optical devices, such as LEDs, advantages also include increased efficacy and reduced thermal resistance. The available technology provides methods related to the transfer process and to the removal of the chip from the host substrate.

The seller would like to be granted a license back.

The seller may consider selling these patents individually.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 107: Assembly of plural semiconductive substrates each possessing electrical device
Subclass 26: Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Subclass 28: Plural emissive devices
Subclass 36: Ordered or disordered

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass E21.06: Changing shape of semiconductor body, e.g., forming recesses (EPO)
Subclass E21.499: Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)
Subclass E33.055: Detail of nonsemiconductor component other than light-emitting semiconductor device (EPO)

View this listing on the Tynax website: www.tynax.com/listing/6447