Patent for Sale:Methods for Transfer of Semiconductor Die, Including LEDs
The available technology includes two patents. The first focuses on methods of making a transferable chip, including the use of a radiation-enhanced lift-off layer that is weakened by irradiation through a substrate transparent to that radiation. The chip, while attached to the host substrate, is adhered to a target substrate, irradiated through the host substrate to weaken the radiation enhanced lift-off layer and then separated from the host substrate.
The second patent focuses on methods of transferring semiconductor die from a host substrate to a target substrate using a selectively formed electrostatic charge to temporarily adhere the die to a transfer substrate, transferring the die to a target substrate and releasing the die from the transfer substrate to the target substrate. The die may also be transferred directly to the target substrate, without the use of a transfer substrate.
Primary Application of the Technology
The seller would like to be granted a license back.
The seller may consider selling these patents individually.
Class 438: Semiconductor Device Manufacturing: Process
This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.Subclass 107: Assembly of plural semiconductive substrates each possessing electrical device
Subclass 26: Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Subclass 28: Plural emissive devices
Subclass 36: Ordered or disordered
Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)
This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.Subclass E21.06: Changing shape of semiconductor body, e.g., forming recesses (EPO)
Subclass E21.499: Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)
Subclass E33.055: Detail of nonsemiconductor component other than light-emitting semiconductor device (EPO)