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Private Listing: Number 5452 Private  

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Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 15.2: By heat pipe
Subclass 16.3: With heat sink
Subclass 250: Preformed panel circuit arrangement (e.g., printed circuit)
Subclass 251: With encapsulated wire
Subclass 253: Micropanel
Subclass 255: With particular substrate or support structure
Subclass 257: Conducting (e.g., ink)
Subclass 260: With electrical device
Subclass 261: With particular conductive connection (e.g., crossover)
Subclass 262: Feedthrough
Subclass 264: Voidless (e.g., solid)
Subclass 266: Hollow (e.g., plated cylindrical hole)
Subclass 268: With single conductive plane (e.g., tape, cable)

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 532: Including capacitor component
Subclass 621: With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body)
Subclass 676: With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED)
Subclass 685: Multiple housings
Subclass 686: Stacked arrangement
Subclass 698: With specific electrical feedthrough structure
Subclass 707: Directly attached to semiconductor device
Subclass 708: Entirely of metal except for feedthrough
Subclass 712: With provision for cooling the housing or its contents
Subclass 715: Boiling (evaporative) liquid
Subclass 718: Heat dissipating element held in place by clamping or spring means
Subclass 719: Pressed against semiconductor element
Subclass 720: Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)
Subclass 722: With fins
Subclass 723: For plural devices
Subclass 724: With discrete components
Subclass 737: Bump leads
Subclass 738: Ball shaped
Subclass 766: At least one layer containing chromium or nickel
Subclass 774: Via (interconnection hole) shape
Subclass 778: Flip chip
Subclass 779: Solder wettable contact, lead, or bond
Subclass 780: Ball or nail head type contact, lead, or bond
Subclass 782: Die bond
Subclass 783: With adhesive means
Subclass 784: Wire contact, lead, or bond
Subclass 786: Configuration or pattern of bonds
Subclass 789: With specified filler material
Subclass E25.013: Stacked arrangements of devices (EPO)
Subclass E23.004: Characterized by shape (EPO)
Subclass E23.02: Bonding areas, e.g., pads (EPO)
Subclass E23.021: Bump or ball contacts (EPO)
Subclass E23.062: Multilayer substrates (EPO)
Subclass E23.063: Chip support structure consisting of plurality of insulating substrates (EPO)
Subclass E23.067: Via connections through substrates, e.g., pins going through substrate, coaxial cables (EPO)
Subclass E23.068: Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (EPO)
Subclass E23.069: Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)
Subclass E23.07: Geometry or layout (EPO)
Subclass E23.075: Conductive materials containing organic materials or pastes, e.g., for thick films (EPO)
Subclass E23.079: For integrated circuit devices, e.g., power bus, number of leads (EPO)
Subclass E23.083: Mountings or securing means for detachable cooling or heating arrangements; fixed by friction, plugs or springs (EPO)
Subclass E23.086: Snap-on arrangements, e.g., clips (EPO)
Subclass E23.087: Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (EPO)
Subclass E23.088: Cooling by change of state, e.g., use of heat pipes (EPO)
Subclass E23.098: By flowing liquids (EPO)
Subclass E23.099: By flowing gases, e.g., air (EPO)
Subclass E23.102: Cooling facilitated by shape of device (EPO)
Subclass E23.109: Metallic materials (EPO)
Subclass E23.11: Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (EPO)
Subclass E23.114: Protection against radiation, e.g., light, electromagnetic waves (EPO)
Subclass E23.172: Assembly of plurality of insulating substrates (EPO)
Subclass E23.173: Multilayer substrates (EPO)
Subclass E23.174: Conductive vias through substrate with or without pins, e.g., buried coaxial conductors (EPO)
Subclass E23.175: Geometry or layout of interconnection structure (EPO)
Subclass E21.503: Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)
Subclass E21.505: Insulative mounting semiconductor device on support (EPO)
Subclass E21.511: Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)
Subclass E21.519: Involving application of pressure, e.g., thermo-compression bonding (EPO)

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 306.3: For multilayer capacitor
Subclass 313: Layered
Subclass 321.3: Including metallization coating
Subclass 690: Air
Subclass 695: Fan or blower
Subclass 699: Liquid
Subclass 700: Change of physical state
Subclass 702: With cold plate or heat sink
Subclass 704: Thermal conduction
Subclass 705: By specific coating
Subclass 708: Specific chemical compound or element
Subclass 715: For module
Subclass 719: Circuit board mounted
Subclass 735: Stacked
Subclass 736: With printed circuit boards
Subclass 737: IC card or card member
Subclass 748: Printed circuit board
Subclass 760: Connection of components to board
Subclass 767: With mounting pad
Subclass 777: By specific pattern on board
Subclass 779: With specific connection material
Subclass 788: Having backplane connection
Subclass 792: Plural contiguous boards
Subclass 794: Power, voltage, or current layer
Subclass 796: With housing or chassis
Subclass 803: Interconnection details
Subclass 807: Component mounting or support means
Subclass 810: Plural mounting or support

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 106: PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR
Subclass 107: Assembly of plural semiconductive substrates each possessing electrical device
Subclass 108: Flip-chip-type assembly
Subclass 118: Including adhesive bonding step
Subclass 125: Insulative housing or support
Subclass 14: WITH MEASURING OR TESTING
Subclass 458: Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Subclass 612: Forming solder contact or bonding pad
Subclass 667: Conductive feedthrough or through-hole in substrate
Subclass 668: Specified aspect ratio of conductor or viahole
Subclass 672: Plug formation (i.e., in viahole)
Subclass 689: CHEMICAL ETCHING
Subclass 697: Planarization by etching and coating
Subclass 706: Vapor phase etching (i.e., dry etching)
Subclass 976: TEMPORARY PROTECTIVE LAYER

Class 428: Stock Material Or Miscellaneous Articles

This is the residual class for: 1. Stock material in the form of a structurally defined web, sheet, rod, strand, fiber, filament, cell, flake, particle not provided elsewhere. 2. Stock material in the form of a web, sheet, mass or layer which consists of or contains a structurally defined constituent or element. 3. A nonstructural laminate defined merely in terms of the composition of one or more layers. 4. An article of manufacture or an intermediate-article not provided for elsewhere. 5. A process for applying an impregnating material to a naturally solid product such as a wood beam, a sheet of leather or a stone, or for applying a coating to a base, and which process includes no significant method step.

Subclass 106: Wood grain
Subclass 118: Hexagonally shaped cavities
Subclass 119: Including sheet or component perpendicular to plane of web or sheet
Subclass 209: Including metal layer
Subclass 210: Including ceramic, glass, porcelain or quartz layer

Class 29: Metal Working

Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.

Subclass 830: Assembling bases
Subclass 831: Assembling formed circuit to base
Subclass 832: Assembling to base an electrical component, e.g., capacitor, etc.
Subclass 836: Different components
Subclass 840: By metal fusion
Subclass 846: Manufacturing circuit on or in base
Subclass 847: With selective destruction of conductive paths
Subclass 849: Simultaneous circuit manufacturing
Subclass 850: By using wire as conductive path
Subclass 852: By forming conductive walled aperture in base
Subclass 740: Chip component

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 13: FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.)
Subclass 17: Forming or treating of groove or through hole
Subclass 18: Filling or coating of groove or through hole with a conductor to form an electrical interconnection
Subclass 20: Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)
Subclass 39: FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED
Subclass 40: FORMING PATTERN USING LIFT OFF TECHNIQUE
Subclass 58: GAS PHASE ETCHING OF SUBSTRATE
Subclass 67: Using plasma

Class 439: Electrical Connectors

This is the generic class for a pair of mated conductors comprising at least two electrically conducting elements which are interconnected to permit relative motion of such conducting elements during use without a break in electrical conductivity therebetween. Also, this is the generic class for a device constituting an electricity conducting contact between conductors of electricity; wherein the joint is of a type which may be readily made and broken, repeatedly by attachment and detachment of contact supporting structure on each conductor.

Subclass 47: Panel member having planar surface for supporting circuit and parallel surface for supporting second circuit
Subclass 511: Including plural prongs
Subclass 65: With provision to conduct electricity from panel circuit to another panel circuit
Subclass 69: Overlying second, coextensive micro panel circuit arrangement
Subclass 74: Overlying second preformed panel circuit, both adapted to be electrically connected
Subclass 75: Connected by transversely inserted pin

Class 385: Optical Waveguides

(1) An optical waveguiding element, which conveys light from one point to another through an optically transparent elongated structure by modal transmission, total internal reflection, or total reflectorization. (2) A combination of an optical waveguiding element with an additional broadly recited optical element which couples light or a combination. (3) A combination of an optical waveguiding element with structure which mechanically joins this waveguiding element with another or with a diverse optical element. (4) An optical modulator where the modulation of a light wave characteristic is performed exclusively within an optical waveguiding element. (5) Other miscellaneous devices formed of an optical waveguide (e.g., a waveguide sensing device) and supplemental devices which are limited to use with an optical waveguide (e.g., an external clamp or retainer).

Subclass 14: INTEGRATED OPTICAL CIRCUIT
Subclass 49: Fiber to thin film devices
Subclass 52: With alignment device
Subclass 88: Optical fiber to a nonfiber optical device connector

Class 427: Coating Processes

This is the generic class for: A. applying or obtaining a coating on a surface. The coating may be hard or soft, permanent or transitory, supplied solely by extraneous materials or supplied wholly or in part by the base material. B. impregnating a base by causing a coating material to extend or penetrate into the base material, or into the interstices of a porous, cellular or foraminous material. C. taking preparatory treatments of the base material, subsequent treatments of the coated base material and other ancillary noncoating operations claimed, per se, processes limited to etching for making a base more compatible with, or adherent to, the coating wherein the base is the substrate (work) onto which a coating is applied are included.

Subclass 282: Mask or stencil utilized
Subclass 376.1: Inorganic coating
Subclass 554: Laser
Subclass 569: Plasma (e.g., corona, glow discharge, cold plasma, etc.)
Subclass 576: Metal, metal alloy, or metal oxide coating
Subclass 579: Silicon oxides or nitrides
Subclass 96.9: Front and back of substrate coated (excluding processes where all coating is by immersion)
Subclass 97.2: Coating hole wall
Subclass 97.3: Nonuniform or patterned coating
Subclass 98.3: Heating (e.g., curing, etc.)
Subclass 98.5: With pretreatment of substrate

Class 165: Heat Exchange

Apparatus or process not provided for in other classes for transferring heat, or apparatus or process not provided for in other classes relating to an auxiliary device particularly adapted to be used with such heat transfer apparatus.

Subclass 104.21: Utilizing change of state
Subclass 104.29: Utilizing formed bubble
Subclass 104.33: Cooling electrical device
Subclass 185: HEAT TRANSMITTER
Subclass 80.2: Electrical component
Subclass 80.3: Air cooled, including fins
Subclass 80.4: Liquid cooled

Class 375: Pulse Or Digital Communications

This is the generic class for pulse or digital communication systems using electrical or electromagnetic signals. Such communication includes transmitting an intelligence bearing signal from one point to another in the form of discrete variations in some parameter of the electrical or electromagnetic signal.

Subclass 220: Transmission interface between two stations or terminals
Subclass 257: CABLE SYSTEMS AND COMPONENTS
Subclass 285: Antinoise or distortion

Class 370: Multiplex Communications

This is the generic class for multiplexing or duplexing systems, methods, or apparatus.

Subclass 201: CROSSTALK SUPPRESSION

Class 228: Metal Fusion Bonding

Method of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of: (a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or (b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.

Subclass 164: Prior to bonding
Subclass 180.22: Lead-less (or bumped) device
Subclass 215: By confining filler
Subclass 39: With means to mask or stop work

Class 156: Adhesive Bonding And Miscellaneous Chemical Manufacture

This is the generic class for: Manufacturing processes and apparatus; manufacture of articles of commerce in which one of the manufacturing steps includes a chemical reaction; manufacture of panels from settable inorganic compositions; manufacture of electrical conductors of indefinite length.

Subclass 155: With destruction of solid transitory material; e.g., dissolving, melting, etc.
Subclass 246: On temporary planar support (e.g., film casting)
Subclass 247: With stripping of adhered lamina
Subclass 248: With cutting of one lamina only while adhered
Subclass 272.2: With direct application of electrical, magnetic, or radiant energy to work
Subclass 272.6: Exposure of work to corona or glow discharge
Subclass 273.3: Before final assembly; e.g., to cure lamina, etc.
Subclass 273.9: Work constitutes conductor of electrical circuit

Class 250: Radiant Energy

This class provides for all methods and apparatus for using, generating, controlling or detecting radiant energy, combinations including such methods or apparatus, subcombinations of same and accessories therefore not classifiable elsewhere.

Subclass 559.3: With alignment detection
Subclass 215: Combined with diverse-type device

Class 356: Optics: Measuring And Testing

Methods and apparatus (1) for analyzing light to measure or test its characteristics, such as intensity, color and polarization; (2) for determining the optical or nonoptical properties of materials or articles by noting, as by inspection, measurement, or test the effect produced by the materials or articles on light associated therewith; and (3) for measuring the dimensions of structures or the spatial relationships such as distances or angle bearings of spaced points by comparison of the respective properties (usually direction or spatial position) of the light from these points or by comparison of the properties of these lights with some scale or standard. The light analyzing includes or is for spectroscopy, interference, polarization, beam direction or pattern, focal position of a light source, shade or color, and photometers. The material or article properties determined are or involve crystal or gem examination, material strain analysis, blood analysis, optical pyrometers, egg candling, cutting blade sharpness, oil testing, document verification, flatness, lens or reflector testing, refraction testing, monitoring moving webs or fabrics, light transmission or absorption, light reflection, inspection for flaws or imperfections in materials, and thread counting. The dimensioning and spatial relationship determination includes triangulation by a light beam, contour plotting, range or height finders, motion stopping, velocity or velocity/height measuring, sighting where the optical element or reticle moves with the sighted object, particle size determination, particle light scattering, electrophoresis, angle measuring or axial alignment, mensuration or configuration comparison, alignment in a lateral direction, and fiducial instruments.

Subclass 400: With light detector (e.g., photocell)

Class 324: Electricity: Measuring And Testing

This is the residual home for all subject matter, not elsewhere classified, relating to the measuring, testing (or sensing) of electric properties, (e.g., determining ground resistivity, determining frequency of an alternating current, determining kilowatt hour demand), or the measuring, testing or sensing of nonelectric properties by electric means (e.g., determining moisture, a nonelectric property, by measuring conductance with a resistance bridge; determining speed, a nonelectric property by use of an electric tachometer).


Class 62: Refrigeration

(1) processes and apparatus peculiar to removing heat from a substance, usually by a change of phase of a coolant or refrigerant, as by evaporation, melting or sublimation, (2) the resultant product of part (1), e.g., ice, liquefied or solidified gases, and (3) processes and apparatus peculiar to handling the latter as a stored product, not elsewhere provided for.

Subclass 259.2: With electrical component cooling

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 311: Making electrical device
Subclass 312: Including multiple resist image formation
Subclass 314: Etching of substrate and material deposition
Subclass 316: Multiple etching of substrate
Subclass 317: Insulative or nonmetallic dielectric etched
Subclass 322: Forming nonplanar surface
Subclass 324: Including material deposition
Subclass 330: Including heating
Subclass 394: PLURAL EXPOSURE STEPS

Class 345: Computer Graphics Processing And Selective Visual Display Systems

Processes and apparatus for selective electrical control of two or more light-generating or light-controlling display elements* in accordance with a received or stored image data signal. The image data includes character, graphical information or display attribute data. The image data may include, for example, information data from a peripheral input device, from the reception of a television signal, from the recognition of image data, or from the generation or creation of image data by a computer.

Subclass 156: DISPLAY PERIPHERAL INTERFACE INPUT DEVICE
Subclass 168: Including keyboard
Subclass 169: Portable (i.e., handheld, calculator, remote controller)
Subclass 173: Touch panel
Subclass 174: Including impedance detection

Class 700: Data Processing: Generic Control Systems Or Specific Applications

This class is structured into two main divisions: (1)for the combination of a data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) AND a device or apparatus controlled thereby, the entirety hereinafter referred to as a "control system". (2)for data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) wherein the data processing or calculating computer apparatus is designed for or utilized in a particular art device, system, process, or environment, or is utilized for the solution of a particular problem in a field other than mathematics (arithmetic processing per se is classified elsewhere).

Subclass 300: For heating or cooling