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Private Listing: Number 5060 Private  

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Overview

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Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 108: Flip-chip-type assembly
Subclass 118: Including adhesive bonding step
Subclass 406: Bonding of plural semiconductive substrates
Subclass 455: BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES
Subclass 456: Having enclosed cavity
Subclass 460: SEMICONDUCTOR SUBSTRATE DICING
Subclass 51: Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Subclass 53: Having diaphragm element
Subclass 612: Forming solder contact or bonding pad

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 252: Responsive to non-optical, non-electrical signal
Subclass 253: Chemical (e.g., ISFET, CHEMFET)
Subclass 254: Physical deformation (e.g., strain sensor, acoustic wave detector)
Subclass 772: Solder composition
Subclass 778: Flip chip
Subclass 779: Solder wettable contact, lead, or bond
Subclass E23.004: Characterized by shape (EPO)
Subclass E21.122: Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (EPO)
Subclass E21.499: Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)

Class 29: Metal Working

Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.

Subclass 621.1: Strain gauge making

Class 73: Measuring And Testing

Processes and apparatus for making a measurement of any kind or for making a test of any kind, and takes all such subject matter not provided for in other classes. The term "test" includes inspection, processes and apparatus for determining qualities by inspection being included where not provided for in other classes. This class is the generic class for sampling and takes all sampling apparatus and processes not otherwise provided.

Subclass 514.35: Electric

Class 148: Metal Treatment

Treating metal to modify or maintain the internal physical structure or chemical properties of metal. Most processes in this class relate to treating solid or semisolid metal with heat, without melting a substantial portion thereof, and also includes the combination of significant heating and working not provided for in other metal working classes. Cooling of metal to produce microstructure change is proper for this class. It includes processes of treating metal to intentionally develop, improve, modify, or preserve the magnetic properties of a free metal or alloy, occurring alone or mixed with one or more components. Also included are processes of reactive coating of metal wherein an externally supplied carburizing or nitriding agent is combined with the metal substrate to produce a carburized or nitridized or carbonitrided coating thereon or a uniformly carburized, nitrided, or carbonitrided metal alloy containing a metal element from said substrate.

Subclass 33.2: With recess, void, dislocation, grain boundaries or channel openings

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 2: ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION
Subclass 33: ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.)

Class 83: Cutting

Methods and machines for penetrating material, without substantial reshaping flow of such material, by means of (1) a solid tool, or fluid current, either of which applies mechanical deforming force to the material by direct physical contact therewith, the fluid current forcing the material against a solid tool whose edge defines the line of cut; (2) a heated solid tool which directly engages the material (to effect penetration thereof by melting, or by transmission of mechanical energy, or both); or (3) opposed, controlled fluid currents.

Subclass 15: By heating or cooling
Subclass 22: By fluid application

Class 428: Stock Material Or Miscellaneous Articles

This is the residual class for: 1. Stock material in the form of a structurally defined web, sheet, rod, strand, fiber, filament, cell, flake, particle not provided elsewhere. 2. Stock material in the form of a web, sheet, mass or layer which consists of or contains a structurally defined constituent or element. 3. A nonstructural laminate defined merely in terms of the composition of one or more layers. 4. An article of manufacture or an intermediate-article not provided for elsewhere. 5. A process for applying an impregnating material to a naturally solid product such as a wood beam, a sheet of leather or a stone, or for applying a coating to a base, and which process includes no significant method step.

Subclass 426: Of quartz or glass
Subclass 432: Next to metal or compound thereof