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Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 136: Enhancement mode (e.g., so-called SITs)
Subclass 242: Vertical charge transfer
Subclass 250: Plural gate levels
Subclass 301: Capacitor in trench
Subclass 302: Vertical transistor
Subclass 303: Stacked capacitor
Subclass 306: Stacked capacitor
Subclass 308: With capacitor electrodes connection portion located centrally thereof (e.g., fin electrodes with central post)
Subclass 309: With increased effective electrode surface area (e.g., tortuous path, corrugated, or textured electrodes)
Subclass 310: With high dielectric constant insulator (e.g., Ta 2 O 5 )
Subclass 315: With floating gate electrode
Subclass 329: Gate controls vertical charge flow portion of channel (e.g., VMOS device)
Subclass 331: Plural gate electrodes or grid shaped gate electrode
Subclass 361: For operation as bipolar or punchthrough element
Subclass 362: Punchthrough or bipolar element
Subclass 388: Gate electrode consists of refractory or platinum group metal or silicide
Subclass 506: Including dielectric isolation means
Subclass 509: Combined with pn junction isolation (e.g., isoplanar, LOCOS)
Subclass 534: With means to increase surface area (e.g., grooves, ridges, etc.)
Subclass E27.081: Including field-effect component (EPO)
Subclass E27.091: Transistor in trench (EPO)
Subclass E27.096: Vertical transistor (EPO)
Subclass E27.103: Electrically programmable ROM (EPO)
Subclass E27.112: Including insulator on semiconductor, e.g. SOI (silicon on insulator) (EPO)
Subclass E29.055: With vertical doping variation (EPO)
Subclass E29.118: For vertical current flow (EPO)
Subclass E29.135: Characterized by length or sectional shape (EPO)
Subclass E29.146: On silicon (EPO)
Subclass E29.262: Vertical transistor (EPO)
Subclass E29.266: With lightly doped drain or source extension (EPO)
Subclass E29.274: Vertical transistor (EPO)
Subclass E29.304: Charging by tunneling of carriers (e.g., Fowler-Nordheim tunneling) (EPO)
Subclass E29.313: Vertical transistors (EPO)
Subclass E29.318: Vertical transistors (EPO)
Subclass E29.346: Trench capacitor (EPO)
Subclass E21.012: With increased surface area, e.g., by roughening, texturing (EPO)
Subclass E21.013: With rough surface, e.g., using hemispherical grains (EPO)
Subclass E21.016: Made by depositing layers, e.g., alternatingly conductive and insulating layers (EPO)
Subclass E21.018: Having vertical extensions (EPO)
Subclass E21.019: Made by depositing layers, e.g., alternatingly conductive and insulating layers (EPO)
Subclass E21.165: Conductive layer comprising silicide (EPO)
Subclass E21.2: Conductor comprising metal or metallic silicide formed by deposition e.g., sputter deposition, i.e., without silicidation reaction (EPO)
Subclass E21.205: Characterized by sectional shape, e.g., T-shape, inverted T, spacer (EPO)
Subclass E21.209: Making electrode structure comprising conductor-insulator-conuctor-insulator-semiconductor, e.g., gate stack for non-volatile memory (EPO)
Subclass E21.214: To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (EPO)
Subclass E21.241: Post-treatment (EPO)
Subclass E21.244: Involving dielectric removal step (EPO)
Subclass E21.258: Using masks (EPO)
Subclass E21.259: Organic layers, e.g., photoresist (EPO)
Subclass E21.279: On silicon body (EPO)
Subclass E21.3: Post treatment (EPO)
Subclass E21.309: By liquid etching only (EPO)
Subclass E21.337: Through-implantation (EPO)
Subclass E21.396: Metal-insulator-semiconductor capacitor, e.g., trench capacitor (EPO)
Subclass E21.41: Vertical transistor (EPO)
Subclass E21.433: Where the source and drain or source and drain extensions are self-aligned to sides of gate (EPO)
Subclass E21.434: With initial gate mask or masking layer complementary to prospective gate location, e.g., with dummy source and drain contacts (EPO)
Subclass E21.507: Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (EPO)
Subclass E21.525: Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (EPO)
Subclass E21.527: Optical enhancement of defects or not directly visible states, e.g., selective electrolytic deposition, bubbles in liquids, light emission, color change (EPO)
Subclass E21.53: For structural parameters, e.g., thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (EPO)
Subclass E21.538: Making of internal connections, substrate contacts (EPO)
Subclass E21.552: Using local oxidation of silicon, e.g., LOCOS, SWAMI, SILO (EPO)
Subclass E21.553: In region recessed from surface, e.g., in recess, groove, tub or trench region (EPO)
Subclass E21.559: With plurality of successive local oxidation steps (EPO)
Subclass E21.577: By forming via holes (EPO)
Subclass E21.582: Characterized by formation and post treatment of conductors, e.g., patterning (EPO)
Subclass E21.584: Barrier, adhesion or liner layer (EPO)
Subclass E21.585: Filling of holes, grooves, vias or trenches with conductive material (EPO)
Subclass E21.59: Local interconnects; local pads (EPO)
Subclass E21.629: With particular manufacturing method of vertical transistor structures, i.e., with channel vertical to substrate surface (EPO)
Subclass E21.632: Complementary field-effect transistors, e.g., CMOS (EPO)
Subclass E21.643: With particular manufacturing method of vertical transistor structures, i.e., with channel vertical to substrate surface (EPO)
Subclass E21.648: Capacitor stacked over transfer transis tor (EPO)
Subclass E21.652: In combination with vertical transistor (EPO)
Subclass E21.653: Making connection between transistor and capacitor, e.g., buried strap (EPO)
Subclass E21.655: Transistor in U- or V-shaped trench in substrate (EPO)
Subclass E21.691: Simultaneous fabrication of periphery and memory cells (EPO)
Subclass E21.693: For vertical channel (EPO)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 225: Recessed oxide formed by localized oxidation (i.e., LOCOS)
Subclass 229: Self-aligned
Subclass 231: Plural doping steps
Subclass 241: And additional field effect transistor (e.g., sense or access transistor, etc.)
Subclass 242: Including transistor formed on trench sidewalls
Subclass 243: Trench capacitor
Subclass 244: Utilizing stacked capacitor structure (e.g., stacked trench, buried stacked capacitor, etc.)
Subclass 245: With epitaxial layer formed over the trench
Subclass 246: Including doping of trench surfaces
Subclass 247: Multiple doping steps
Subclass 248: Including isolation means formed in trench
Subclass 249: Doping by outdiffusion from a dopant source layer (e.g., doped oxide, etc.)
Subclass 253: Stacked capacitor
Subclass 255: Including texturizing storage node layer
Subclass 257: Having additional gate electrode surrounded by dielectric (i.e., floating gate)
Subclass 259: Including forming gate electrode in trench or recess in substrate
Subclass 267: Including forming gate electrode as conductive sidewall spacer to another electrode
Subclass 270: Gate electrode in trench or recess in semiconductor substrate
Subclass 282: Buried channel
Subclass 284: Closed or loop gate
Subclass 290: After formation of source or drain regions and gate electrode
Subclass 303: Utilizing gate sidewall structure
Subclass 305: Plural doping steps
Subclass 386: Trench capacitor
Subclass 387: Having stacked capacitor structure (e.g., stacked trench, buried stacked capacitor, etc.)
Subclass 388: With epitaxial layer formed over the trench
Subclass 389: Including doping of trench surfaces
Subclass 391: Including isolation means formed in trench
Subclass 392: Doping by outdiffusion from a dopant source layer (e.g., doped oxide)
Subclass 396: Stacked capacitor
Subclass 398: Including texturizing storage node layer
Subclass 42: Groove formation
Subclass 439: Recessed oxide by localized oxidation (i.e., LOCOS)
Subclass 444: Preliminary etching of groove
Subclass 446: Polysilicon containing sidewall
Subclass 448: Utilizing oxidation mask having polysilicon component
Subclass 452: Plural oxidation steps to form recessed oxide
Subclass 588: Plural gate levels
Subclass 589: Recessed into semiconductor substrate
Subclass 591: Gate insulator structure constructed of plural layers or nonsilicon containing compound
Subclass 592: Possessing plural conductive layers (e.g., polycide)
Subclass 596: Portion of sidewall structure is conductive
Subclass 622: Multiple metal levels, separated by insulating layer (i.e., multiple level metallization)
Subclass 624: Separating insulating layer is laminate or composite of plural insulating materials
Subclass 630: Silicide formation
Subclass 631: Having planarization step
Subclass 637: With formation of opening (i.e., viahole) in insulative layer
Subclass 640: Having viahole of tapered shape
Subclass 649: Silicide
Subclass 655: Silicide
Subclass 664: Forming silicide
Subclass 675: Plug formation (i.e., in viahole)
Subclass 680: Utilizing chemical vapor deposition (i.e., CVD)
Subclass 682: Silicide
Subclass 683: Of refractory group metal (i.e., titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), or alloy thereof)
Subclass 687: Copper of copper alloy conductor
Subclass 692: Simultaneous (e.g., chemical-mechanical polishing, etc.)
Subclass 703: Plural coating steps
Subclass 762: At least one layer formed by reaction with substrate
Subclass 763: Layers formed of diverse composition or by diverse coating processes
Subclass 765: By reaction with substrate
Subclass 769: Reaction with silicon semiconductive region (e.g., oxynitride formation, etc.)
Subclass 788: Using electromagnetic or wave energy (e.g., photo-induced deposition, plasma, etc.)
Subclass 789: Organic reactant
Subclass 790: Organic reactant

Class 239: Fluid Sprinkling, Spraying, And Diffusing

The general class for claims pertaining to the spraying, sprinkling, or scattering of fluids or fluent solids either in the form of slurries or as dry material, over an extended area on a surface, including - weather control or modification, diffusers, fountains, drinking tubes and straw, dry pulverulent material, terminal fluid handling elements and orifice shapes.

Subclass 106: Nozzle cleaner, flusher or drainer
Subclass 215: With separate pump or movable conveyer means delivering to distributor
Subclass 219: Slinger or splasher dipping into or immersed in supply
Subclass 223: Disc impeller type or bowl-like slinger or deflector
Subclass 224: Disc or impeller type
Subclass 231: Including deflector
Subclass 499: Chamber-like deflector
Subclass 502: Plural deflectors arranged edgewise to stream
Subclass 520: Plural outlets to deflector

Class 134: Cleaning And Liquid Contact With Solids

Cleaning, i.e., the separation or removal of adherent dirt, scale, tarnish, impurities or any other foreign or undesired matter from solid materials or objects whether or not the resultant separated ingredients are recovered in whole or in part for subsequent use. Cleaning may be performed by, or may involve as a part thereof, contacting solids with liquids. The contacting of solids with liquids may be for purposes other than cleaning.

Subclass 1.2: Semiconductor cleaning

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 85: By optical means or of an optical property
Subclass 88: Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 5: Radiation mask
Subclass 322: Forming nonplanar surface
Subclass 330: Including heating

Class 250: Radiant Energy

This class provides for all methods and apparatus for using, generating, controlling or detecting radiant energy, combinations including such methods or apparatus, subcombinations of same and accessories therefore not classifiable elsewhere.

Subclass 442.11: With object moving or positioning means
Subclass 492.21: Ion bombardment
Subclass 492.23: Variable beam
Subclass 492.3: Ion or electron beam irradiation

Class 451: Abrading

The term "abrading" (grinding) may include a polishing device that acts by removal of an integral portion of the material acted upon, but not such as depends upon the application of a coating capable of taking a polish by friction or upon a compression, consolidation, or swaging of the material. Every invention relating to abrading must have to do either with an abrading element; a tool consisting of an abrading element or material and a holder by which it may be put to use; a machine embodying an abrading material or tool and means for moving it or the work, or an action equivalent to that of a tool; a holder for the work; a method or process of abrading; an attachment or accessory to a tool, machine, or process; or a plurality of these features. Note: A cutting device and an abrasive tool distinguished solely by the abrasive material or composition will be found elsewhere.

Subclass 11: With feeding of tool or work holder
Subclass 164: Rectilinear
Subclass 285: Rotary work holder
Subclass 287: Planar surface abrading
Subclass 320: Reciprocating work holder
Subclass 324: Rotary work holder
Subclass 36: Utilizing fluent abradant
Subclass 41: Glass or stone abrading
Subclass 443: Dressing
Subclass 444: Tool cleaner
Subclass 446: Abradant supplying
Subclass 58: Utilizing mounted rigid abrading tool only
Subclass 60: Abradant supplying
Subclass 63: Side face of disk
Subclass 8: With indicating

Class 977: Nanotechnology

This art collection provides for disclosures related to: nanostructure and chemical compositions of nanostructure; device that include at least one nanostructure; mathematical algorithms, e.g., computer software, etc., specifically adapted for modeling configurations or properties of nanostructure; methods or apparatus for making, detecting, analyzing, or treating nanostructure; and specified particular uses of nanostructure. the term "nanostructure" is defined to mean an atomic, molecular, or macromolecular structure that: has at least one physical dimension of approximately 1-100 nanometers; and possesses a special property, provides a special function, or produces a special effect that is uniquely attributable to the structure s nanoscale physical size.

Subclass 775: Nanosized powder or flake (e.g., nanosized catalyst, etc.)

Class 454: Ventilation

This is the parent class for apparatus and processes for supplying air to and removing it from enclosures, for distributing and circulating the air therein, or for preventing its contamination.

Subclass 56: Covered workbench chamber (e.g., fume hood, etc.)

Class 33: Geometrical Instruments

Means for determining the characteristics and the mutual relation of points, lines, angles, surfaces, and solids, considered as having no properties but those arising from extension and difference of situation. It includes mechanically guided means for describing lines.

Subclass 1C: Curve and chart analysis
Subclass 1V: Volume measurement
Subclass 1BB: Inspection
Subclass 501.05: Comparator
Subclass 545: Comparison with a standard
Subclass 549: With support for gauged article
Subclass 561.1: Conformator or adjustable curve template

Class 414: Material Or Article Handling

Apparatus, device, implement or method for placing or displacing particular articles in a particular manner or with reference to a particular support, for loading or unloading vehicles with materials or objects in general, charging or discharging furnaces, bins, chambers, or other receptacles, stacking or piling articles or materials, also combinations of general types of carriers or forwarding mechanisms, which types, per se, are separately classified elsewhere, and general types of elevators, cranes, or hoists when associated with special means for handling the load to place it on the carrier or remove it therefrom.

Subclass 800: PROCESS

Class 156: Adhesive Bonding And Miscellaneous Chemical Manufacture

This is the generic class for: Manufacturing processes and apparatus; manufacture of articles of commerce in which one of the manufacturing steps includes a chemical reaction; manufacture of panels from settable inorganic compositions; manufacture of electrical conductors of indefinite length.

Subclass 64: With measuring, testing, or inspecting

Class 30: Cutlery

(1) cutting implements including those for cutting by a sharp point, which are manipulable by hand. Such implements may be power operated and the motive power means may be built into the structure of the cutting implement. (2) special machines which are not hand manipulable, namely, special machines and fixed cutters in which the work moves relative to the machine or cutter, since these structures are too closely related to the hand cutters to separate; see necked receptacle seal cutters, can openers, carton openers, cigar tip cutters, cord cutters, and segmenters. (3) hand manipulable scrapers having a sharpened scraping or cutting edge. (4) culinary and table forks and spoons due to their close relation to knives in use and manufacture.

Subclass 457: Having conical or cylindrical work guide
Subclass 458: And mounting base or handle
Subclass 461: Adjustable or resilient cutter structure

Class 324: Electricity: Measuring And Testing

This is the residual home for all subject matter, not elsewhere classified, relating to the measuring, testing (or sensing) of electric properties, (e.g., determining ground resistivity, determining frequency of an alternating current, determining kilowatt hour demand), or the measuring, testing or sensing of nonelectric properties by electric means (e.g., determining moisture, a nonelectric property, by measuring conductance with a resistance bridge; determining speed, a nonelectric property by use of an electric tachometer).

Class 29: Metal Working

Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.

Subclass 281.1: With work-holder for assembly

Class 702: Data Processing:Measuring, Calibrating, Or Testing

This class provides for apparatus and corresponding methods wherein the data processing system or calculating computer is designed for or utilized in an environment relating to a specific or generic measurement system, a calibration or correction system, or a testing system.

Subclass 179: Statistical measurement

Class 700: Data Processing: Generic Control Systems Or Specific Applications

This class is structured into two main divisions: (1)for the combination of a data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) AND a device or apparatus controlled thereby, the entirety hereinafter referred to as a "control system". (2)for data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) wherein the data processing or calculating computer apparatus is designed for or utilized in a particular art device, system, process, or environment, or is utilized for the solution of a particular problem in a field other than mathematics (arithmetic processing per se is classified elsewhere).

Subclass 59: Having optical sensing (e.g., image projection)

Class 427: Coating Processes

This is the generic class for: A. applying or obtaining a coating on a surface. The coating may be hard or soft, permanent or transitory, supplied solely by extraneous materials or supplied wholly or in part by the base material. B. impregnating a base by causing a coating material to extend or penetrate into the base material, or into the interstices of a porous, cellular or foraminous material. C. taking preparatory treatments of the base material, subsequent treatments of the coated base material and other ancillary noncoating operations claimed, per se, processes limited to etching for making a base more compatible with, or adherent to, the coating wherein the base is the substrate (work) onto which a coating is applied are included.

Subclass 255.14: Organic compound containing coating
Subclass 255.6: Organic coating applied by vapor, gas, or smoke
Subclass 407.1: Synthetic resin coating
Subclass 9: Thickness or uniformity of thickness determined

Class 356: Optics: Measuring And Testing

Methods and apparatus (1) for analyzing light to measure or test its characteristics, such as intensity, color and polarization; (2) for determining the optical or nonoptical properties of materials or articles by noting, as by inspection, measurement, or test the effect produced by the materials or articles on light associated therewith; and (3) for measuring the dimensions of structures or the spatial relationships such as distances or angle bearings of spaced points by comparison of the respective properties (usually direction or spatial position) of the light from these points or by comparison of the properties of these lights with some scale or standard. The light analyzing includes or is for spectroscopy, interference, polarization, beam direction or pattern, focal position of a light source, shade or color, and photometers. The material or article properties determined are or involve crystal or gem examination, material strain analysis, blood analysis, optical pyrometers, egg candling, cutting blade sharpness, oil testing, document verification, flatness, lens or reflector testing, refraction testing, monitoring moving webs or fabrics, light transmission or absorption, light reflection, inspection for flaws or imperfections in materials, and thread counting. The dimensioning and spatial relationship determination includes triangulation by a light beam, contour plotting, range or height finders, motion stopping, velocity or velocity/height measuring, sighting where the optical element or reticle moves with the sighted object, particle size determination, particle light scattering, electrophoresis, angle measuring or axial alignment, mensuration or configuration comparison, alignment in a lateral direction, and fiducial instruments.

Subclass 625: DIMENSION
Subclass 630: Thickness