Patent for Sale:

Semiconductor Heat Dissipation Invention    

Patent portfolio addressing heat dissipation in semiconductor chips

Overview

International patent family addresses a method of manufacturing a heat-reduction technology.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 29: Metal Working

Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.

Subclass 890.03: Heat exchanger or boiler making
Subclass 890.032: Heat pipe device making

Class 165: Heat Exchange

Apparatus or process not provided for in other classes for transferring heat, or apparatus or process not provided for in other classes relating to an auxiliary device particularly adapted to be used with such heat transfer apparatus.

Subclass 104.33: Cooling electrical device
Subclass 80.4: Liquid cooled

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass E23.088: Cooling by change of state, e.g., use of heat pipes (EPO)
Subclass E23.099: By flowing gases, e.g., air (EPO)