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Patent for Sale:

Multi Chip Modules    

Semiconductor Multi Chip Module (MCM / MCP) & System Package (SIP) devices and manufacturing

Overview

MCP/SIP package technology can include mixed functions such as processor, DRAM, flash memory, resistors, capacitors, etc. mounted on the same package substrate. Applications include space constrained devices such as tablets, mobile phones, MP3 players, cameras, etc. expected to reach a market of USD$4B in 2015.

These inventions improve yields and the use of off-the-shelf components for significant cost savings. Inventions describe how to simplify chip interoperability and communication protocols, as well as solve in-situ test challenges. In addition, these inventions describe the use of redundancy to repair post-packaging memory failures and pin multiplexing to reduce packaging complexity and testing costs. Other inventions relate to heat removal through a mechanically improved MCP/SIP heat spreader. Topics also include:

- Different types of memory sharing same address space
- In-situ memory fail detection and repair
- Tested pin reduction during individual in-package die test
- Reduction of inter die connections
- Noise isolation
- Package cover accommodating mounted height variations
- Mechanical stress reduction
- etc.

The patents have early priority dates ranging from 2001.

Primary Application of the Technology

Tablets, mobile phones, cameras, media players, game consols, etc.

The seller would like to be granted a license back.

The seller may consider selling these patents individually.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 678: HOUSING OR PACKAGE
Subclass 685: Multiple housings
Subclass 690: With contact or lead
Subclass 713: For integrated circuit
Subclass 723: For plural devices
Subclass E23.086: Snap-on arrangements, e.g., clips (EPO)
Subclass E23.094: Pistons, e.g., spring-loaded members (EPO)
Subclass E23.104: Characterized by shape of housing (EPO)

Class 365: Static Information Storage And Retrieval

Apparatus or corresponding processes for the static storage and retrieval of information. For classification herein, the storage system must be (1) static, (2) a singular storage element or plural elements of the same type, (3) addressable.

Subclass 189.02: Multiplexing
Subclass 189.03: Plural use of terminal
Subclass 201: Testing
Subclass 230.02: Multiplexing

Class 714: Error Detection/Correction And Fault Detection/Recovery

This class provides for process or apparatus for detecting and correcting errors in electrical pulse or pulse coded data; it also provides for process or apparatus for detecting and recovering from faults in electrical computers and digital data processing systems, as well as logic level based systems.

Subclass 25: Fault locating (i.e., diagnosis or testing)
Subclass 30: Built-in hardware for diagnosing or testing within-system component (e.g., microprocessor test mode circuit, scan path)
Subclass 42: Memory or storage device component fault
Subclass 54: Storage content error
Subclass 710: Replacement of memory spare location, portion, or segment
Subclass 711: Spare row or column
Subclass 718: Memory testing
Subclass 719: Read-in with read-out and compare
Subclass 725: Programmable logic array (PLA) testing
Subclass 733: Built-in testing circuit (BILBO)
Subclass 734: Structural (in-circuit test)
Subclass 742: Testing specific device

Class 324: Electricity: Measuring And Testing

This is the residual home for all subject matter, not elsewhere classified, relating to the measuring, testing (or sensing) of electric properties, (e.g., determining ground resistivity, determining frequency of an alternating current, determining kilowatt hour demand), or the measuring, testing or sensing of nonelectric properties by electric means (e.g., determining moisture, a nonelectric property, by measuring conductance with a resistance bridge; determining speed, a nonelectric property by use of an electric tachometer).