SEARCH
Tynax ~ Patent Library

Patent for Sale:

Semiconducto Devices and Manufacture    

Display Panels, Nanodevices & ICs

Overview

This portfolio relates to:
- AMLCD active matrix LCD displays
- LED devices
- Silicon Carbide nanodevices
- Micro solder bumps on Copper pads
- Substrate adhesion promoters
- Chip stacking & connection
- Type III-VI EBIC response enhancement
- etc.

The seller would like to be granted a license back.

The seller may consider selling these patents individually.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 228: Metal Fusion Bonding

Method of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of: (a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or (b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.

Subclass 118: Using bond inhibiting separating material
Subclass 180.22: Lead-less (or bumped) device
Subclass 254: Adherent solid layer or coating (e.g., pretinned)

Class 219: Electric Heating

This class includes all those devices commonly known as electric heaters, electric-heating metal working apparatus, electrically-heated tools and instruments. This is the generic class for electric heating devices, per se. Devices and systems equipped with electric heating means in which the electric heating means is combined with or includes specific other art structure whereby the heated material is withdrawn, stored or otherwise utilized will also be classified in the appropriate other art class to which it pertains.

Subclass 121.75: With lens

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 108: Flip-chip-type assembly
Subclass 125: Insulative housing or support
Subclass 455: BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES
Subclass 458: Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Subclass 459: Thinning of semiconductor substrate
Subclass 492: Fluid growth step with preceding and subsequent diverse operation
Subclass 493: Plural fluid growth steps with intervening diverse operation
Subclass 500: Fluid growth from liquid combined with subsequent diverse operation
Subclass 509: Heat treatment
Subclass 588: Plural gate levels
Subclass 796: Compound semiconductor
Subclass 82: Having organic semiconductor component
Subclass 95: Chalcogen (i.e., oxygen (O), sulfur (S), selenium (Se), tellurium (Te)) containing
Subclass 99: HAVING ORGANIC SEMICONDUCTIVE COMPONENT

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 40: ORGANIC SEMICONDUCTOR MATERIAL
Subclass 700: Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)
Subclass 729: Portion of housing of specific materials
Subclass 777: Chip mounted on chip
Subclass 778: Flip chip
Subclass E33.073: Refractive means (e.g., lens) (EPO)
Subclass E25.013: Stacked arrangements of devices (EPO)
Subclass E23.079: For integrated circuit devices, e.g., power bus, number of leads (EPO)
Subclass E23.169: Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (EPO)
Subclass E23.175: Geometry or layout of interconnection structure (EPO)
Subclass E21.122: Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (EPO)
Subclass E21.259: Organic layers, e.g., photoresist (EPO)
Subclass E21.326: Of Group III-V compound (EPO)
Subclass E21.497: Thermal treatment for modifying property of semiconductor body, e.g., annealing, sintering (EPO)
Subclass E21.503: Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)
Subclass E21.568: With separation/delamination along ion implanted layer, e.g., Smart-cut, Unibond (EPO)

Class 156: Adhesive Bonding And Miscellaneous Chemical Manufacture

This is the generic class for: Manufacturing processes and apparatus; manufacture of articles of commerce in which one of the manufacturing steps includes a chemical reaction; manufacture of panels from settable inorganic compositions; manufacture of electrical conductors of indefinite length.

Subclass 325: Particular adhesive
Subclass 326: Organic containing

Class 385: Optical Waveguides

(1) An optical waveguiding element, which conveys light from one point to another through an optically transparent elongated structure by modal transmission, total internal reflection, or total reflectorization. (2) A combination of an optical waveguiding element with an additional broadly recited optical element which couples light or a combination. (3) A combination of an optical waveguiding element with structure which mechanically joins this waveguiding element with another or with a diverse optical element. (4) An optical modulator where the modulation of a light wave characteristic is performed exclusively within an optical waveguiding element. (5) Other miscellaneous devices formed of an optical waveguide (e.g., a waveguide sensing device) and supplemental devices which are limited to use with an optical waveguide (e.g., an external clamp or retainer).

Subclass 14: INTEGRATED OPTICAL CIRCUIT

Class 349: Liquid Crystal Cells, Elements And Systems

Cells, elements, and systems which include molecules of a material having both liquid and crystalline properties. Included in this class are those which have a significant liquid crystal cell detail or liquid crystal response or properties, and in which the liquid crystal controls or changes the optical properties of electromagnetic radiation such as direction, phase, amplitude, frequency, or polarization state. This class also provides for nominal manufacturing methods for producing significant liquid crystal cell structure.

Subclass 43: Structure of transistor
Subclass 46: With particular gate electrode structure

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 2: ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION
Subclass 33: ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.)
Subclass 41: MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST)
Subclass 52: MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE
Subclass 54: PATTERN OR DESIGN APPLIED BY TRANSFER
Subclass 79: Etching silicon containing substrate
Subclass 88: Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)

Class 264: Plastic And Nonmetallic Article Shaping Or Treating: Processes

Processes for molding, casting, or shaping of nonmetallic materials to produce articles. Liquid or melt comminuting of materials other than glass or metal. Uniting or compacting of bulk or randomly assembled particles. Furnace Lining or repair. Melt shaping in the absence of a mold or shaping surface, e.g., spheroidizing of particles. Working or treatment of nonmetallic materials not otherwise provided for.

Subclass 320: Reshaping solid work or introducing solid work into mold cavity