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Patent for Sale:

Semiconductor Packaging - Lot 7    




Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 533: Outside of housing

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 531: Including inductive element
Subclass 669: With stress relief
Subclass 692: With particular lead geometry
Subclass 737: Bump leads
Subclass 738: Ball shaped
Subclass 773: Of specified configuration
Subclass 778: Flip chip
Subclass 779: Solder wettable contact, lead, or bond
Subclass 780: Ball or nail head type contact, lead, or bond
Subclass 781: Layered contact, lead or bond
Subclass 782: Die bond
Subclass 784: Wire contact, lead, or bond
Subclass 786: Configuration or pattern of bonds
Subclass E23.004: Characterized by shape (EPO)
Subclass E23.02: Bonding areas, e.g., pads (EPO)
Subclass E23.021: Bump or ball contacts (EPO)
Subclass E23.039: Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (EPO)
Subclass E23.048: Bent parts being outer leads (EPO)
Subclass E23.061: Leads being also applied on sidewalls or bottom of substrate, e.g., leadless packages for surface mounting (EPO)
Subclass E23.068: Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (EPO)
Subclass E23.07: Geometry or layout (EPO)
Subclass E23.079: For integrated circuit devices, e.g., power bus, number of leads (EPO)
Subclass E23.114: Protection against radiation, e.g., light, electromagnetic waves (EPO)
Subclass E23.119: Organic, e.g., plastic, epoxy (EPO)
Subclass E23.124: Device being completely enclosed (EPO)
Subclass E23.129: Partial encapsulation or coating (EPO)
Subclass E21.503: Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)
Subclass E21.506: Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (EPO)
Subclass E21.508: Forming solder bumps (EPO)
Subclass E21.511: Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)
Subclass E21.518: Involving application of mechanical vibration, e.g., ultrasonic vibration (EPO)

Class 156: Adhesive Bonding And Miscellaneous Chemical Manufacture

This is the generic class for: Manufacturing processes and apparatus; manufacture of articles of commerce in which one of the manufacturing steps includes a chemical reaction; manufacture of panels from settable inorganic compositions; manufacture of electrical conductors of indefinite length.

Subclass 233: Metal foil lamina
Subclass 234: Of portion only of lamina from carrier
Subclass 235: Plural transferring operations and/or with additional laminating
Subclass 297: Of discrete laminae to single face of additional lamina
Subclass 300: With covering of discrete laminae with additional lamina

Class 228: Metal Fusion Bonding

Method of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of: (a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or (b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.

Subclass 180.22: Lead-less (or bumped) device
Subclass 180.5: Wire bonding
Subclass 248.1: Applied in powdered or particulate form
Subclass 4.5: Wire lead bonder

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 108: Flip-chip-type assembly
Subclass 115: Including contaminant removal or mitigation
Subclass 123: Lead frame
Subclass 612: Forming solder contact or bonding pad
Subclass 613: Bump electrode
Subclass 614: Plural conductive layers
Subclass 617: By wire bonding
Subclass 652: Plural layered electrode or conductor
Subclass 653: At least one layer forms a diffusion barrier
Subclass 656: Having refractory group metal (i.e., titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), or alloy thereof)
Subclass 661: Subsequent fusing conductive layer
Subclass 666: Specified configuration of electrode or contact
Subclass 687: Copper of copper alloy conductor
Subclass 688: Aluminum or aluminum alloy conductor

Class 134: Cleaning And Liquid Contact With Solids

Cleaning, i.e., the separation or removal of adherent dirt, scale, tarnish, impurities or any other foreign or undesired matter from solid materials or objects whether or not the resultant separated ingredients are recovered in whole or in part for subsequent use. Cleaning may be performed by, or may involve as a part thereof, contacting solids with liquids. The contacting of solids with liquids may be for purposes other than cleaning.

Subclass 1.3: Semiconductor cleaning

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 704: Thermal conduction
Subclass 707: Through support means
Subclass 751: With particular conductive material or coating
Subclass 760: Connection of components to board
Subclass 764: Integrated circuit
Subclass 767: With mounting pad

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