Patent for Sale:

LED Die & Array Lens Packaging    

For Solid State LED Lighting & Lamps


IP relates to LED die arrays integrated with beam shaping lenses and/or mirrors and methods of manufacturing

The seller may consider selling these patents individually.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 81: With specific housing or contact structure
Subclass 88: Plural light emitting devices (e.g., matrix, 7-segment array)
Subclass 98: With reflector, opaque mask, or optical element (e.g., lens, optical fiber, index of refraction matching layer, luminescent material layer, filter) integral with device or device enclosure or package
Subclass E33.059: Encapsulation (EPO)
Subclass E33.068: Integrated with device (e.g., back surface reflector, lens) (EPO)
Subclass E33.077: Monolithic integration with photosensitive device (EPO)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 27: Having additional optical element (e.g., optical fiber, etc.)
Subclass 28: Plural emissive devices