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Private Listing: Number 3431 Private  

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Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 760: Connection of components to board
Subclass 779: With specific connection material
Subclass 783: Having semiconductive device
Subclass 803: Interconnection details

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 260: With electrical device

Class 228: Metal Fusion Bonding

Method of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of: (a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or (b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.

Subclass 180.22: Lead-less (or bumped) device

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 621: With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body)
Subclass 690: With contact or lead
Subclass 692: With particular lead geometry
Subclass 698: With specific electrical feedthrough structure
Subclass 723: For plural devices
Subclass 777: Chip mounted on chip
Subclass 779: Solder wettable contact, lead, or bond
Subclass 783: With adhesive means
Subclass E29.022: Characterized by shape of semiconductor body (EPO)
Subclass E25.012: Devices being arranged next to each other (EPO)
Subclass E23.011: Internal lead connections, e.g., via connections, feedthrough structures (EPO)
Subclass E23.078: Flexible arrangements, e.g., pressure contacts without soldering (EPO)
Subclass E21.159: Deposition of conductive or insulating material for electrode conducting electric current (EPO)
Subclass E21.161: Of conductive layer (EPO)
Subclass E21.174: From a liquid, e.g., electrolytic deposition (EPO)
Subclass E21.511: Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)
Subclass E21.597: Formed through semiconductor substrate (EPO)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 106: PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR
Subclass 107: Assembly of plural semiconductive substrates each possessing electrical device
Subclass 117: Incorporating resilient component (e.g., spring, etc.)
Subclass 456: Having enclosed cavity
Subclass 612: Forming solder contact or bonding pad
Subclass 618: Contacting multiple semiconductive regions (i.e., interconnects)
Subclass 667: Conductive feedthrough or through-hole in substrate
Subclass 675: Plug formation (i.e., in viahole)
Subclass 677: Pretreatment of surface to enhance or retard deposition

Class 977: Nanotechnology

This art collection provides for disclosures related to: nanostructure and chemical compositions of nanostructure; device that include at least one nanostructure; mathematical algorithms, e.g., computer software, etc., specifically adapted for modeling configurations or properties of nanostructure; methods or apparatus for making, detecting, analyzing, or treating nanostructure; and specified particular uses of nanostructure. the term "nanostructure" is defined to mean an atomic, molecular, or macromolecular structure that: has at least one physical dimension of approximately 1-100 nanometers; and possesses a special property, provides a special function, or produces a special effect that is uniquely attributable to the structure s nanoscale physical size.

Subclass 890: Deposition of materials (e.g., coating, CVD, or ALD, etc.)
Subclass 892: Liquid phase deposition

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 322: Forming nonplanar surface
Subclass 323: Including etching substrate
Subclass 324: Including material deposition
Subclass 325: Post image treatment to produce elevated pattern

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 27: FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT HEAD, LIQUID JET RECORDING HEAD, ETC.)

Class 347: Incremental Printing Of Symbolic Information

Processes and apparatus for conveying information by selectively creating on a medium a visibly distinguishable symbol or mark composed of a plurality of portions; created portion by portion as, for example, by pixels or dots. The symbol or mark may be an alphanumeric character or an image.

Subclass 54: Drop-on-demand
Subclass 55: With electric field ejection (applied to fluid)