Tynax ~ Patent Library

Patent for Sale:

Multi-Beam Patent Portfolio for Accurate High-Speed Placement and Overlay    

Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during exposure.


Patent portfolio covering direct-write technologies for rapid writing of masks and wafers using multiple electron-beams.

These inventions assure very tight control of the beam shape, the stage carrying the semiconductor wafer, the raster scan of the beam, dose modulation and pixel deflection, etc.

This I.P. focuses on advances required to meet specifications in real-world manufacturing environments.

Areas addressed include:

- CD Uniformity and Linearity.
- Placement and Overlay Accuracy.
- Multi-beam Throughput Enhancement.
- High Performance Air Bearing Stage (field proven).

Primary Application of the Technology

The primary application is the use of multiple electron beams for direct writing of semiconductor wafers.

The seller would like to be granted a license back.

The seller may consider selling these patents individually.

Additional Information

An audio interview with one of the inventors is available on request, and so is a voice narrated slideshow presentation.
Other materials are available, and the seller has expertise on-hand to explain the technology and answer questions.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 700: Data Processing: Generic Control Systems Or Specific Applications

This class is structured into two main divisions: (1)for the combination of a data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) AND a device or apparatus controlled thereby, the entirety hereinafter referred to as a "control system". (2)for data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) wherein the data processing or calculating computer apparatus is designed for or utilized in a particular art device, system, process, or environment, or is utilized for the solution of a particular problem in a field other than mathematics (arithmetic processing per se is classified elsewhere).

Subclass 121: Integrated circuit production or semiconductor fabrication

Class 250: Radiant Energy

This class provides for all methods and apparatus for using, generating, controlling or detecting radiant energy, combinations including such methods or apparatus, subcombinations of same and accessories therefore not classifiable elsewhere.

Subclass 311: Electron microscope type
Subclass 397: With detector
Subclass 398: With target means
Subclass 492.2: Irradiation of semiconductor devices
Subclass 492.22: Pattern control
Subclass 492.3: Ion or electron beam irradiation
Subclass 494.1: Plural radiation sources

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 296: Electron beam imaging
Subclass 313: With formation of resist image, and etching of substrate or material deposition

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 401: Having substrate registration feature (e.g., alignment mark)
Subclass 7: Optical characteristic sensed
Subclass 949: Energy beam treating radiation resist on semiconductor

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.


Class 356: Optics: Measuring And Testing

Methods and apparatus (1) for analyzing light to measure or test its characteristics, such as intensity, color and polarization; (2) for determining the optical or nonoptical properties of materials or articles by noting, as by inspection, measurement, or test the effect produced by the materials or articles on light associated therewith; and (3) for measuring the dimensions of structures or the spatial relationships such as distances or angle bearings of spaced points by comparison of the respective properties (usually direction or spatial position) of the light from these points or by comparison of the properties of these lights with some scale or standard. The light analyzing includes or is for spectroscopy, interference, polarization, beam direction or pattern, focal position of a light source, shade or color, and photometers. The material or article properties determined are or involve crystal or gem examination, material strain analysis, blood analysis, optical pyrometers, egg candling, cutting blade sharpness, oil testing, document verification, flatness, lens or reflector testing, refraction testing, monitoring moving webs or fabrics, light transmission or absorption, light reflection, inspection for flaws or imperfections in materials, and thread counting. The dimensioning and spatial relationship determination includes triangulation by a light beam, contour plotting, range or height finders, motion stopping, velocity or velocity/height measuring, sighting where the optical element or reticle moves with the sighted object, particle size determination, particle light scattering, electrophoresis, angle measuring or axial alignment, mensuration or configuration comparison, alignment in a lateral direction, and fiducial instruments.

Subclass 396: With scale or optical grid displaced relative to remote fiducial mark

Class 358: Facsimile And Static Presentation Processing

Communication or reproduction of a static image or sequence of static images in which the local light, or density variations composing the image do not vary with time by a method or apparatus involving at least one of the following steps: (1) scanning a static image to capture an image-containing area by resolving it into an area; (2) communication of an image-representative signal or image-representative data over any supporting communication network; or (3) reproduction of an image-containing area in response to an image-representative signal or image-representative image data by reproducing a corresponding image area which at least one of the two dimensions is elemental, simultaneously or in a sequence. In this class, a facsimile system or method is a system or method for the communication or reproduction of an arbitrarily composed image in which the local light, or density variations composing the image do not vary with time, such as documents maps, charts, photographs, etc., but not motion picture film or video.

Subclass 1.2: Size, resolution, or scale control
Subclass 1.8: Dot matrix array (e.g., printheads, etc.)
Subclass 1.9: Attribute control
Subclass 3.01: Multi-level image reproduction (e.g., gray level reproduction)
Subclass 3.06: Halftoning (e.g., a pattern of print elements used to represent a gray level)
Subclass 3.21: Adaptive multi-level image reproduction
Subclass 3.24: Adaptive image reproduction

Class 347: Incremental Printing Of Symbolic Information

Processes and apparatus for conveying information by selectively creating on a medium a visibly distinguishable symbol or mark composed of a plurality of portions; created portion by portion as, for example, by pixels or dots. The symbol or mark may be an alphanumeric character or an image.

Subclass 19: Measuring and testing (e.g., diagnostics)
Subclass 24: For color
Subclass 253: By varying intensity of light beam
Subclass 254: By varying dotting density

Class 324: Electricity: Measuring And Testing

This is the residual home for all subject matter, not elsewhere classified, relating to the measuring, testing (or sensing) of electric properties, (e.g., determining ground resistivity, determining frequency of an alternating current, determining kilowatt hour demand), or the measuring, testing or sensing of nonelectric properties by electric means (e.g., determining moisture, a nonelectric property, by measuring conductance with a resistance bridge; determining speed, a nonelectric property by use of an electric tachometer).

Subclass 71.3: Beam of atomic particles

Class 382: Image Analysis

This is the generic class for apparatus and corresponding methods for the automated analysis of an image or recognition of a pattern. Included herein are systems that transform an image for the purpose of (a) enhancing its visual quality prior to recognition, (b) locating and registering the image relative to a sensor or stored prototype, or reducing the amount of image data by discarding irrelevant data, and (c) measuring significant characteristics of the image.

Subclass 141: Manufacturing or product inspection
Subclass 145: Inspection of semiconductor device or printed circuit board
Subclass 167: Color correction
Subclass 203: Shape and form analysis
Subclass 209: Template matching (e.g., specific devices that determine the best match)