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Patent for Sale:

Heat Sink Technology    

Eight granted U.S. patents

Overview

The technology relates to thermally coupling heat sources to heat sinks using integrated interleaved-fin connectors, heat sink retaining brackets, heat sinks with metal base and graphite fins, and disk drive enclosures with cooling fins.

Exemplary patent generally relates to a heat transfer device that is used with a retention assembly and includes a base pedestal, fins, lever guides and guide rails.

Patent Lot Citations: This portfolio has forward reference by the following companies: Apple, Dell, Delta Electronics, Fujitsu, Foxconn Technology, Hitachi, IBM, Intel, Inventec Corporation, Quanta Computer, Sony, Sun Microsystems, and Toshiba.

Primary Application of the Technology

Computer accessories

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 165: Heat Exchange

Apparatus or process not provided for in other classes for transferring heat, or apparatus or process not provided for in other classes relating to an auxiliary device particularly adapted to be used with such heat transfer apparatus.

Subclass 185: HEAT TRANSMITTER
Subclass 80.3: Air cooled, including fins

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 16.1: By ventilation or gas circulation
Subclass 16.3: With heat sink

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 707: Directly attached to semiconductor device
Subclass 712: With provision for cooling the housing or its contents
Subclass 713: For integrated circuit
Subclass 714: Liquid coolant
Subclass 717: Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)
Subclass 718: Heat dissipating element held in place by clamping or spring means
Subclass 720: Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)
Subclass 722: With fins
Subclass 724: With discrete components
Subclass 726: Devices held in place by clamping
Subclass E23.09: Auxiliary members in containers characterized by their shape, e.g., pistons (EPO)
Subclass E23.099: By flowing gases, e.g., air (EPO)
Subclass E23.102: Cooling facilitated by shape of device (EPO)
Subclass E23.103: Foil-like cooling fins or heat sinks (EPO)
Subclass E23.108: Semiconductor materials (EPO)
Subclass E23.11: Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (EPO)

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 688: With cooling means
Subclass 697: With heat sink or cooling fins
Subclass 702: With cold plate or heat sink
Subclass 703: With cooling fins
Subclass 704: Thermal conduction
Subclass 707: Through support means
Subclass 713: Electrically insulating thermally conductive
Subclass 714: Through component housing
Subclass 717: For active solid state devices
Subclass 725: With retractable or readily detachable chassis
Subclass 727: Sliding component or commpartment
Subclass 741: Guiding means
Subclass 754: With ejector means

Class 436: Chemistry: Analytical And Immunological Testing

This is the generic class for: chemical test standards, analytical compositions, and processes which involve a chemical reaction for determining qualitatively or quantitatively the presence of a chemical element, compound or complex in a composition or a chemical compound, or an element or radical in a compound; processes for analysis which involve an in vitro antigen-antibody, immunological or protein binding interaction other than those involving a living antigen, or enzyme label; and processes of analysis or study of the chemical properties of a sample; the physiological effect of a sample; or chemical determination of a physical property of a sample. Compositions and their mere methods of use of thermoparticulating compositions. Combinations of tests or measurements with methods of regulating a chemical reaction not otherwise provided for in a chemical synthesis class or otherwise.

Subclass 122: Sulfur dioxide

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 121: Metallic housing or support

Class 248: Supports

Devices which carry the weight of an article or articles or otherwise hold or steady it or them against the pull of gravity, and devices for holding an article to its support, which are not otherwise provided for.

Subclass 225.21: Bracket interengaging portion includes a hook
Subclass 694: MISCELLANEOUS