SEARCH
Tynax ~ Patent Library

Patent for Sale:

Ink-Jet Printing Nozzle    

Patented technique for manufacture of precise ink-jet printer nozzles

Overview

This patent covers the use of an isotrophic etching step to create a chamber with an aperature that can be used as a nozzle in an ink-jet print head.

Primary Application of the Technology

Manufacture of nozzles for ink-jet printers, and for flat-panel displays.

Competitive Advantage

Nozzle design works with bubble-jet, piezoelectric and other forms of ink-jet drivers.

Flexible design can avoid bonding of the nozzle with the ink driver and accomodate a wide range of nozzle specifications.

The seller would like to be granted a license back.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 347: Incremental Printing Of Symbolic Information

Processes and apparatus for conveying information by selectively creating on a medium a visibly distinguishable symbol or mark composed of a plurality of portions; created portion by portion as, for example, by pixels or dots. The symbol or mark may be an alphanumeric character or an image.

Subclass 20: Ejector mechanism (i.e., print head)

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 27: FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT HEAD, LIQUID JET RECORDING HEAD, ETC.)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 21: MANUFACTURE OF ELECTRICAL DEVICE CONTROLLED PRINTHEAD