Patent for Sale:

Portable Inexpensive Rugged Memory - Fabrication    

Waffle pad embossing process

Overview

This portfolio relates to the waffle pad embossing process for the production of row and column electrodes for terminating pads, and embossed lithography techniques where arrays are roll coated on flexible substrates.

Exemplary Patent(s):
Generally relates to memory structure and fabrication processes for reducing crosstalk between memory cells in a cross point memory array

Patent Lot Citation(s):
This lot is forward referenced by the following companies: Illumina, Infineon, Intel, Samsung, Toppan Printing, and Versatilis LLC.

Primary Application of the Technology

Memory

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 131: Using structure alterable to conductive state (i.e., antifuse)
Subclass 132: Using structure alterable to nonconductive state (i.e., fuse)
Subclass 239: Capacitor
Subclass 243: Trench capacitor
Subclass 244: Utilizing stacked capacitor structure (e.g., stacked trench, buried stacked capacitor, etc.)
Subclass 252: Multiple doping steps
Subclass 577: Utilizing lift-off
Subclass 598: Selectively interconnecting (e.g., customization, wafer scale integration, etc.)
Subclass 600: Using structure alterable to conductive state (i.e., antifuse)
Subclass 601: Using structure alterable to nonconductive state (i.e., fuse)
Subclass 666: Specified configuration of electrode or contact
Subclass 668: Specified aspect ratio of conductor or viahole
Subclass 670: Utilizing lift-off
Subclass 703: Plural coating steps
Subclass 761: Multiple layers
Subclass 800: MISCELLANEOUS
Subclass 942: MASKING

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 104: TUNNELING PN JUNCTION (E.G., ESAKI DIODE) DEVICE
Subclass 499: INTEGRATED CIRCUIT STRUCTURE WITH ELECTRICALLY ISOLATED COMPONENTS
Subclass 577: Including additional component in same, non-isolated structure (e.g., transistor with diode, transistor with resistor, etc.)
Subclass 594: WITH GROOVE TO DEFINE PLURAL DIODES
Subclass 734: COMBINED WITH ELECTRICAL CONTACT OR LEAD
Subclass 739: With textured surface
Subclass 773: Of specified configuration
Subclass E27.026: Integrated circuit having a three-dimensional layout (EPO)
Subclass E27.073: Including diode only (EPO)

Class 365: Static Information Storage And Retrieval

Apparatus or corresponding processes for the static storage and retrieval of information. For classification herein, the storage system must be (1) static, (2) a singular storage element or plural elements of the same type, (3) addressable.

Subclass 105: Diodes
Subclass 165: Coherer
Subclass 174: Semiconductive
Subclass 175: Diodes
Subclass 208: Semiconductors
Subclass 243: Diode

Class 427: Coating Processes

This is the generic class for: A. applying or obtaining a coating on a surface. The coating may be hard or soft, permanent or transitory, supplied solely by extraneous materials or supplied wholly or in part by the base material. B. impregnating a base by causing a coating material to extend or penetrate into the base material, or into the interstices of a porous, cellular or foraminous material. C. taking preparatory treatments of the base material, subsequent treatments of the coated base material and other ancillary noncoating operations claimed, per se, processes limited to etching for making a base more compatible with, or adherent to, the coating wherein the base is the substrate (work) onto which a coating is applied are included.

Subclass 133: MOLD COATING

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 311: Making electrical device
Subclass 322: Forming nonplanar surface