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Patent for Sale:

Semiconductor Packaging    

Fluid filling wafer level packaging cavities

Overview

This portfolio relates to semiconductor packaging. In particular, they relate to fluid filling wafer level packaging cavities, and evaluating electronic designs for via pad rule violations and signal trace discontinuities.

Exemplary Patent(s):
Relates to arranging power bus bars in alternate power and ground stripes to minimize inductance and resistance for accommodating a high powered die.

Patent Lot Citation(s):
This lot is forward referenced by the following companies: Advanced Semiconductor Engineering, Cadence Design, Hon Hai Precision Industry, IBM, Intel, and LSI Logic.

Primary Application of the Technology

Semiconductor

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 761: Component within printed circuit board
Subclass 775: Busbar
Subclass 820: For semiconductor device

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 561: Interlocking

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 678: HOUSING OR PACKAGE
Subclass 691: Having power distribution means (e.g., bus structure)
Subclass 787: ENCAPSULATED
Subclass E23.088: Cooling by change of state, e.g., use of heat pipes (EPO)
Subclass E23.139: Liquid at normal operating temperature of device (EPO)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 106: PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR
Subclass 127: Encapsulating

Class 716: Data Processing: Design And Analysis Of Circuit Or Semiconductor Mask

This class provides for electrical data processing apparatus and corresponding methods for the following subject matter: for sketching, designing, and analyzing circuit components; for planning, designing, analyzing, and devising a template used for etching circuit pattern on semiconductor wafers.

Subclass 4: Testing or evaluating
Subclass 5: Design verification (e.g., wiring line capacitance, fan-out checking, minimum path width)