SEARCH
Tynax ~ Patent Library

Patent for Sale:

Private Listing: Number 3241 Private  

Confidential: Information on this listing is available under NDA to qualifying buyers.

Overview

The owner of this listing has requested that patent numbers, descriptions and other information be provided only to qualifying buyers under confidentiality agreement.

Please review the patent class information to determine if the patent(s) matching your areas of interest.
For more information, click "Tell Me More" and we will be happy to follow up with you.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 228: Metal Fusion Bonding

Method of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of: (a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or (b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.

Subclass 118: Using bond inhibiting separating material
Subclass 180.22: Lead-less (or bumped) device
Subclass 254: Adherent solid layer or coating (e.g., pretinned)

Class 219: Electric Heating

This class includes all those devices commonly known as electric heaters, electric-heating metal working apparatus, electrically-heated tools and instruments. This is the generic class for electric heating devices, per se. Devices and systems equipped with electric heating means in which the electric heating means is combined with or includes specific other art structure whereby the heated material is withdrawn, stored or otherwise utilized will also be classified in the appropriate other art class to which it pertains.

Subclass 121.75: With lens

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 30: INCLUDING CONTROL FEATURE RESPONSIVE TO A TEST OR MEASUREMENT
Subclass 311: Making electrical device

Class 356: Optics: Measuring And Testing

Methods and apparatus (1) for analyzing light to measure or test its characteristics, such as intensity, color and polarization; (2) for determining the optical or nonoptical properties of materials or articles by noting, as by inspection, measurement, or test the effect produced by the materials or articles on light associated therewith; and (3) for measuring the dimensions of structures or the spatial relationships such as distances or angle bearings of spaced points by comparison of the respective properties (usually direction or spatial position) of the light from these points or by comparison of the properties of these lights with some scale or standard. The light analyzing includes or is for spectroscopy, interference, polarization, beam direction or pattern, focal position of a light source, shade or color, and photometers. The material or article properties determined are or involve crystal or gem examination, material strain analysis, blood analysis, optical pyrometers, egg candling, cutting blade sharpness, oil testing, document verification, flatness, lens or reflector testing, refraction testing, monitoring moving webs or fabrics, light transmission or absorption, light reflection, inspection for flaws or imperfections in materials, and thread counting. The dimensioning and spatial relationship determination includes triangulation by a light beam, contour plotting, range or height finders, motion stopping, velocity or velocity/height measuring, sighting where the optical element or reticle moves with the sighted object, particle size determination, particle light scattering, electrophoresis, angle measuring or axial alignment, mensuration or configuration comparison, alignment in a lateral direction, and fiducial instruments.

Subclass 436: Of fluent material
Subclass 442: With light detector
Subclass 443: Of photographic film
Subclass 632: Of light permeable material

Class 156: Adhesive Bonding And Miscellaneous Chemical Manufacture

This is the generic class for: Manufacturing processes and apparatus; manufacture of articles of commerce in which one of the manufacturing steps includes a chemical reaction; manufacture of panels from settable inorganic compositions; manufacture of electrical conductors of indefinite length.

Subclass 295: Adhesive applying to restricted area and spreading thereof by assembly pressure
Subclass 299: All laminae planar and face to face
Subclass 312: Sequential different pressure applying
Subclass 323: Interposing subsequently removed flexible element between lamina and a pressure applying surface
Subclass 382: Evacuated or fluid pressure chamber
Subclass 583.91: Plural adjustable pressure points

Class 100: Presses

Apparatus for subjecting material to compressive force by (a) causing solid surfaces to approach one another while the material is between them, (b) compelling the material to move through a constriction, or (c) by rendering a flexible member taut around the material. This class is the generic class for methods and apparatus for binding material with a flexible filament, strand or band; methods in which material is pressed to compact it to a smaller volume; methods and apparatus for pressing a lid against a receptacle; silos combined with means to compact ensilage within them; presses with a duct or collector for liquid flowing from the material as a result of the pressing; devices for removing from the material a cloth in which the material has been compacted; methods and apparatus for crushing hollow metal bodies such as tin cans, automobile bodies, etc.

Subclass 319: Means to control temperature
Subclass 320: Electric heater
Subclass 326: Heating or cooling element in platen
Subclass 237: Plural movable platens on side-by-side paths
Subclass 266: Return bias

Class 385: Optical Waveguides

(1) An optical waveguiding element, which conveys light from one point to another through an optically transparent elongated structure by modal transmission, total internal reflection, or total reflectorization. (2) A combination of an optical waveguiding element with an additional broadly recited optical element which couples light or a combination. (3) A combination of an optical waveguiding element with structure which mechanically joins this waveguiding element with another or with a diverse optical element. (4) An optical modulator where the modulation of a light wave characteristic is performed exclusively within an optical waveguiding element. (5) Other miscellaneous devices formed of an optical waveguide (e.g., a waveguide sensing device) and supplemental devices which are limited to use with an optical waveguide (e.g., an external clamp or retainer).

Subclass 14: INTEGRATED OPTICAL CIRCUIT

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass E33.073: Refractive means (e.g., lens) (EPO)
Subclass E21.122: Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (EPO)
Subclass E21.568: With separation/delamination along ion implanted layer, e.g., Smart-cut, Unibond (EPO)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 125: Insulative housing or support
Subclass 455: BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES
Subclass 458: Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Subclass 459: Thinning of semiconductor substrate
Subclass 588: Plural gate levels

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 2: ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION
Subclass 33: ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.)
Subclass 41: MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST)
Subclass 52: MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE
Subclass 54: PATTERN OR DESIGN APPLIED BY TRANSFER
Subclass 79: Etching silicon containing substrate
Subclass 88: Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)

Class 264: Plastic And Nonmetallic Article Shaping Or Treating: Processes

Processes for molding, casting, or shaping of nonmetallic materials to produce articles. Liquid or melt comminuting of materials other than glass or metal. Uniting or compacting of bulk or randomly assembled particles. Furnace Lining or repair. Melt shaping in the absence of a mold or shaping surface, e.g., spheroidizing of particles. Working or treatment of nonmetallic materials not otherwise provided for.

Subclass 320: Reshaping solid work or introducing solid work into mold cavity