Tynax ~ Patent Library

Patent for Sale:

Electronics Packaging    

ICs, Power Transistors, Sensors & Module packaging plus Circuit board enclosures


Inventions include:

* Packaging pressure vent & seal
* Metal EMI shroud for molded plastic enclosures
* Enclosure sealing around circuit boards
* Die-cast housing
* Sealed connectors
* Accelerometer/Inertia sensor encapsulation
* Multi-chip modules
* IC solder joint encapsulation
* Continuous IC encapsulation
* Power Transistor/IC encapsulation
* etc

Exceptional Patent Claim Quality: this portfolio includes exemplary US patents ranked within the top 5% of over 10,000 patents in our database of available patents.

Companies referencing this IP include:

Avanex, Bi-Link, Carrier, DaimlerChrysler, Delphi, Denso, Fairchild, FCI, Fujitsu, GM, Hitachi, Honda, IBM, IDC, Infineon, Intel, ITT, KEC, LSI/Agere, Medtronic, National Semiconductor, NSK Steering, Samsung, Panasonic, Philips, Procter & Gamble, Qualcomm MEMS, Rockwell, Siemens, Temec, Toshiba, TRW, WaveZero, etc.

The seller would like to be granted a license back.

The seller may consider selling these patents individually.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 220: Receptacles

Receptacles comprised of a peripheral wall with at least one closed end, and having an access opening which may be an open end of the receptacles, or which may be provided in the peripheral wall or closed end of the receptacle. Receptacles of this class type must function, by disclosure, to hold contents which in turn are to be eventually removed from the receptacle.

Subclass 366.1: Vent at closure, closure support juncture
Subclass 374: Tortuous passage
Subclass 4.02: Electrical housing

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 17VA: Venting, absorption, expansion
Subclass 373: Flange and fastener
Subclass 386: Specific layers
Subclass 50.5: Hermetic sealed envelope type
Subclass 520: With electrical device
Subclass 540: Surrounding lead
Subclass 551: Leads
Subclass 560: Joining parts
Subclass 561: Interlocking
Subclass 563: Recess with mating projection
Subclass 564: Seal
Subclass 59: With connectors
Subclass 61: Fixtures coupling or mounting means

Class 215: Bottles And Jars

Receptacles, usually of glass or ceramic material, of the bottle, jar, or jug type, not special to some particular art and not separately classified. It includes features of construction in the receptacle itself, closures for the receptacle, and attachments of a temporary character--that is, which are not a permanent fixture on the receptacle, but may be used repeatedly on different receptacles.

Subclass 307: Receptacle interior communicable with exterior with closure in applied position (e.g., vented)

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 747: With locking means or device
Subclass 749: Flexible board
Subclass 752: With housing or chassis
Subclass 796: With housing or chassis
Subclass 803: Interconnection details
Subclass 816: Shielding

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 107: Assembly of plural semiconductive substrates each possessing electrical device
Subclass 108: Flip-chip-type assembly
Subclass 123: Lead frame
Subclass 126: And encapsulating

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 686: Stacked arrangement
Subclass 687: Housing or package filled with solid or liquid electrically insulating material
Subclass 690: With contact or lead
Subclass 692: With particular lead geometry
Subclass 693: External connection to housing
Subclass 697: Pin grid type
Subclass 701: Insulating material
Subclass 704: Cap or lid
Subclass 709: With specified insulator to isolate device from housing
Subclass 710: With specified means (e.g., lip) to seal base to cap
Subclass 723: For plural devices
Subclass 778: Flip chip
Subclass 788: With specified encapsulant
Subclass 789: With specified filler material
Subclass 795: With specified filler material
Subclass E25.023: Device consisting of plurality of semiconductor or other solid-state devices or components formed in or on common substrate, e.g., integrated circuit device (EPO)
Subclass E23.052: Assembly of semiconductor devices on lead frame (EPO)
Subclass E23.071: For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (EPO)
Subclass E23.121: Containing filler (EPO)
Subclass E23.135: Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (EPO)
Subclass E23.14: Solid or gel at normal operating temperature of device (EPO)
Subclass E23.172: Assembly of plurality of insulating substrates (EPO)
Subclass E23.185: Other leads being parallel to base (EPO)
Subclass E23.187: Another lead being formed by cover plate parallel to base plate, e.g., sandwich type (EPO)
Subclass E23.193: Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)
Subclass E21.499: Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)
Subclass E21.502: Encapsulation, e.g., encapsulation layer, coating (EPO)
Subclass E21.503: Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)

Class 83: Cutting

Methods and machines for penetrating material, without substantial reshaping flow of such material, by means of (1) a solid tool, or fluid current, either of which applies mechanical deforming force to the material by direct physical contact therewith, the fluid current forcing the material against a solid tool whose edge defines the line of cut; (2) a heated solid tool which directly engages the material (to effect penetration thereof by melting, or by transmission of mechanical energy, or both); or (3) opposed, controlled fluid currents.

Subclass 56: Cut advances across work surface
Subclass 76: Including means to compensate tool speed for work-feed variations

Class 439: Electrical Connectors

This is the generic class for a pair of mated conductors comprising at least two electrically conducting elements which are interconnected to permit relative motion of such conducting elements during use without a break in electrical conductivity therebetween. Also, this is the generic class for a device constituting an electricity conducting contact between conductors of electricity; wherein the joint is of a type which may be readily made and broken, repeatedly by attachment and detachment of contact supporting structure on each conductor.

Subclass 276: Including chamber for contact potting
Subclass 76.1: Within distinct housing spaced from panel circuit arrangement

Class 29: Metal Working

Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.

Subclass 825: Conductor or circuit manufacturing
Subclass 829: On flat or curved insulated base, e.g., printed circuit, etc.
Subclass 830: Assembling bases
Subclass 831: Assembling formed circuit to base
Subclass 832: Assembling to base an electrical component, e.g., capacitor, etc.
Subclass 845: With shaping or forcing terminal into base aperture
Subclass 848: With molding of insulated base

Class 264: Plastic And Nonmetallic Article Shaping Or Treating: Processes

Processes for molding, casting, or shaping of nonmetallic materials to produce articles. Liquid or melt comminuting of materials other than glass or metal. Uniting or compacting of bulk or randomly assembled particles. Furnace Lining or repair. Melt shaping in the absence of a mold or shaping surface, e.g., spheroidizing of particles. Working or treatment of nonmetallic materials not otherwise provided for.

Subclass 263: To unite independent contacting preforms
Subclass 272.15: With component positioning procedure or incorporation of article positioning means