Patent for Sale:Private Listing: Number 2906
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Class 438: Semiconductor Device Manufacturing: Process
This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.Subclass 108: Flip-chip-type assembly
Subclass 113: Substrate dicing
Subclass 118: Including adhesive bonding step
Subclass 124: And encapsulating
Subclass 126: And encapsulating
Subclass 127: Encapsulating
Subclass 612: Forming solder contact or bonding pad
Subclass 613: Bump electrode
Subclass 614: Plural conductive layers
Subclass 615: Including fusion of conductor
Subclass 616: By transcription from auxiliary substrate
Subclass 660: Including heat treatment of conductive layer
Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)
This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.Subclass 773: Of specified configuration
Subclass 778: Flip chip
Subclass 780: Ball or nail head type contact, lead, or bond
Subclass 783: With adhesive means
Subclass 787: ENCAPSULATED
Subclass 789: With specified filler material
Subclass 791: Including polysiloxane (e.g., silicone resin)
Subclass 793: Including epoxide
Subclass 795: With specified filler material
Subclass E23.116: Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (EPO)
Subclass E23.119: Organic, e.g., plastic, epoxy (EPO)
Subclass E23.121: Containing filler (EPO)
Subclass E23.123: Characterized by arrangement or shape (EPO)
Subclass E23.124: Device being completely enclosed (EPO)
Subclass E23.125: Substrate forming part of encapsulation (EPO)
Subclass E23.136: Fillings characterized by material, its physical or chemical properties, or its arrangement within complete device (EPO)
Subclass E21.503: Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)
Subclass E21.511: Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)
Class 29: Metal Working
Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.Subclass 832: Assembling to base an electrical component, e.g., capacitor, etc.
Subclass 840: By metal fusion
Subclass 841: With encapsulating, e.g., potting, etc.
Class 174: Electricity: Conductors And Insulators
This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.Subclass 259: Adhesive/bonding
Subclass 260: With electrical device
Class 525: Synthetic Resins Or Natural Rubbers -- Part Of The Class 520 Series
Part of the Class 520 Series - some general types of subject matter include: Solid synthetic resins, per se, regardless of utility; processes of preparing a synthetic resin involving a chemical reaction; reactable compositions which form a product; processes of purifying a solid synthetic resin or composition containing a synthetic resin by a chemical or physical process; process of reclaiming or recovering a solid synthetic resin; processes of treating a synthetic resin or specified intermediate condensation product with a reactant, or product thereof; blends of solid synthetic resins, processes of preparing or treating such blends; chemically reacted solid synthetic resins or processes of preparing; potentially reactable compositions which contain a solid synthetic resin or SICP and products of such a reaction, or processes of preparing; room vulcanizable potentially reactive compositions which merely require moisture and which are usually activated by heat and/or pressure to form a product; compositions of a nonreactant material and a solid synthetic resin or SICP; compositions containing a structurally defined material which is dispersed in a matrix which is not identified by overall dimension or some structure or processes of preparing; single-layered products containing a solid synthetic resin or composition thereof reciting no structure or dimension, or a fiber, filament, etc., which is no more than the material from which it is made, nonstructured single-layered web or sheet is encompassed; particles or a powder, per se, of a solid synthetic resin or composition thereof for which particles or powder no dimensions are recited; reactable compositions which form a product proper for this class and contain a photoinitiator or photosensitizer which are activated by wave energy or processes of preparing.Subclass 523: Solid polymer contains more than one 1,2-epoxy group or is derived from reactant containing at least one 1,2-epoxy group
Class H01L21: ELECTRICITY - BASIC ELECTRIC ELEMENTS
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR . Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof .
Class H01L23: ELECTRICITY - BASIC ELECTRIC ELEMENTS
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR . Details of semiconductor or other solid state devices .
Class C09K19: CHEMISTRY; METALLURGY - DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE. Liquid crystal materials.
Class C08G59: CHEMISTRY; METALLURGY - ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS . Polycondensates containing more than one epoxy group per molecule .
Class C08L63: CHEMISTRY; METALLURGY - ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS . Compositions of epoxy resins; Compositions of derivatives of epoxy resins .