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Private Listing: Number 2736 Private  

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Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 29: Metal Working

Metal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.

Subclass 25.03: Electrolytic device making (e.g., capacitor)
Subclass 25.41: ELECTRIC CONDENSER MAKING
Subclass 25.42: Solid dielectric type
Subclass 841: With encapsulating, e.g., potting, etc.

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 295: With ferroelectric material layer
Subclass 296: Insulated gate capacitor or insulated gate transistor combined with capacitor (e.g., dynamic memory cell)
Subclass 303: Stacked capacitor
Subclass 306: Stacked capacitor
Subclass 309: With increased effective electrode surface area (e.g., tortuous path, corrugated, or textured electrodes)
Subclass 310: With high dielectric constant insulator (e.g., Ta 2 O 5 )
Subclass E27.048: Capacitor only (EPO)
Subclass E27.116: Thin-film circuits (EPO)
Subclass E23.062: Multilayer substrates (EPO)
Subclass E23.067: Via connections through substrates, e.g., pins going through substrate, coaxial cables (EPO)
Subclass E23.079: For integrated circuit devices, e.g., power bus, number of leads (EPO)
Subclass E23.144: Capacitive arrangements or effects of, or between wiring layers (EPO)
Subclass E21.008: Of capacitor (EPO)
Subclass E21.009: Dielectric having perovskite structure (EPO)
Subclass E21.272: With perovskite structure (EPO)
Subclass E21.526: Connection or disconnection of subentities or redundant parts of device in response to measurement, e.g., wafer scale, memory devices (EPO)
Subclass E21.647: Characterized by type of capacitor (EPO)

Class 361: Electricity: Electrical Systems And Devices

Systems or devices which provide safety and protection for other systems and devices; control circuits for electromagnetic devices and non-electromagnetic-type relays. Systems or devices which discharge, or prevent the accumulation of electrical charge on or in an object or material; circuits for charging objects or materials. Systems for generating or conducting an electric charge. Systems which process electrical speed signals. Circuits for reversing the polarity of an electric circuit. Systems which cause the ignition of a fuel or an explosive charge. Systems and processes for demagnetizing a magnetic field. Transformers and inductors with integral switch, capacitor or lock. Electrostatic capacitors, per se. Housings and mounting assemblies with plural diverse electrical components. Electrolytic systems and devices.

Subclass 263: With spark coil or transformer
Subclass 301.1: Fixed capacitor
Subclass 301.2: Special type (e.g., bypass type)
Subclass 301.3: Encapsulated
Subclass 301.4: Stack
Subclass 302: Feed through
Subclass 303: Significant electrode feature
Subclass 304: Non-self-supporting electrodes
Subclass 306.1: Details of electrical connection means (e.g., terminal or lead)
Subclass 306.3: For multilayer capacitor
Subclass 309: Metallized terminal
Subclass 311: Solid dielectric
Subclass 312: Plural dielectrics
Subclass 313: Layered
Subclass 314: Impregnated
Subclass 315: With specific impregnant
Subclass 320: Ceramic and glass
Subclass 321.1: Ceramic, glass, or oxide particles
Subclass 321.2: With multilayer ceramic capacitor
Subclass 321.3: Including metallization coating
Subclass 321.4: Composition
Subclass 321.5: Composition
Subclass 323: Plastic
Subclass 328: Multiple capacitors
Subclass 329: Distinct physically
Subclass 330: Shared electrode
Subclass 738: With resistor and capacitor
Subclass 763: Capacitor and electrical component
Subclass 766: Capacitor and resistor
Subclass 821: For capacitor and inductor

Class 427: Coating Processes

This is the generic class for: A. applying or obtaining a coating on a surface. The coating may be hard or soft, permanent or transitory, supplied solely by extraneous materials or supplied wholly or in part by the base material. B. impregnating a base by causing a coating material to extend or penetrate into the base material, or into the interstices of a porous, cellular or foraminous material. C. taking preparatory treatments of the base material, subsequent treatments of the coated base material and other ancillary noncoating operations claimed, per se, processes limited to etching for making a base more compatible with, or adherent to, the coating wherein the base is the substrate (work) onto which a coating is applied are included.

Subclass 79: Condenser or capacitor

Class 174: Electricity: Conductors And Insulators

This class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.

Subclass 50.54: With mounting means for a device within envelope
Subclass 250: Preformed panel circuit arrangement (e.g., printed circuit)
Subclass 255: With particular substrate or support structure
Subclass 260: With electrical device

Class 439: Electrical Connectors

This is the generic class for a pair of mated conductors comprising at least two electrically conducting elements which are interconnected to permit relative motion of such conducting elements during use without a break in electrical conductivity therebetween. Also, this is the generic class for a device constituting an electricity conducting contact between conductors of electricity; wherein the joint is of a type which may be readily made and broken, repeatedly by attachment and detachment of contact supporting structure on each conductor.

Subclass 68: Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc.

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 689: CHEMICAL ETCHING