Tynax ~ Patent Library

Patent for Sale:

Semiconductor Wafer & Chip Scale Packaging Technology    

For Connecting MEMS & SOI Wafers


These inventions describe how a Micro Electro Mechanical System (MEMS) wafer is electrically connected to a Silicon on Insulator (SOI) semiconductor wafer.

The seller would like to be granted a license back.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 108: Flip-chip-type assembly
Subclass 119: Electrically conductive adhesive
Subclass 54: Thermally responsive
Subclass 55: Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Subclass 67: Assembly of plural semiconductor substrates
Subclass 69: Including integrally formed optical element (e.g., reflective layer, luminescent layer, etc.)

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 257: Light responsive or combined with light responsive device
Subclass 685: Multiple housings
Subclass 686: Stacked arrangement
Subclass 780: Ball or nail head type contact, lead, or bond
Subclass E21.499: Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO)