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High Throughput Defect Analysis Technology    

Improve productivity of defect analysis using unique marking methods

Overview

Methods to improve defect analysis productivity and throughput which include methods for selectively marking wafers as well as defect analysis on mirror and notched wafers. Methods enable reduction or targeting errors from high magnification image devices, coordinate transformation, wafer marking to form an accurate wafer coordinate system. All of the above combined can produce a high throughput defect analysis.

Primary Application of the Technology

Semiconductor manufacturing and defect inspection.

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Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 356: Optics: Measuring And Testing

Methods and apparatus (1) for analyzing light to measure or test its characteristics, such as intensity, color and polarization; (2) for determining the optical or nonoptical properties of materials or articles by noting, as by inspection, measurement, or test the effect produced by the materials or articles on light associated therewith; and (3) for measuring the dimensions of structures or the spatial relationships such as distances or angle bearings of spaced points by comparison of the respective properties (usually direction or spatial position) of the light from these points or by comparison of the properties of these lights with some scale or standard. The light analyzing includes or is for spectroscopy, interference, polarization, beam direction or pattern, focal position of a light source, shade or color, and photometers. The material or article properties determined are or involve crystal or gem examination, material strain analysis, blood analysis, optical pyrometers, egg candling, cutting blade sharpness, oil testing, document verification, flatness, lens or reflector testing, refraction testing, monitoring moving webs or fabrics, light transmission or absorption, light reflection, inspection for flaws or imperfections in materials, and thread counting. The dimensioning and spatial relationship determination includes triangulation by a light beam, contour plotting, range or height finders, motion stopping, velocity or velocity/height measuring, sighting where the optical element or reticle moves with the sighted object, particle size determination, particle light scattering, electrophoresis, angle measuring or axial alignment, mensuration or configuration comparison, alignment in a lateral direction, and fiducial instruments.

Subclass 237.2: Surface condition
Subclass 237.3: Detection of object or particle on surface
Subclass 398: With object being compared and light beam moved relative to each other (e.g., scanning)
Subclass 614: POSITION OR DISPLACEMENT
Subclass 615: Position transverse to viewing axis
Subclass 72: WITH PLURAL DIVERSE TEST OR ART

Class 250: Radiant Energy

This class provides for all methods and apparatus for using, generating, controlling or detecting radiant energy, combinations including such methods or apparatus, subcombinations of same and accessories therefore not classifiable elsewhere.

Subclass 307: Methods
Subclass 559.3: With alignment detection
Subclass 559.44: Identifying marking, pattern, or indicia

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass E21.525: Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (EPO)
Subclass E21.53: For structural parameters, e.g., thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (EPO)

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 12: And removal of defect
Subclass 14: WITH MEASURING OR TESTING
Subclass 16: Optical characteristic sensed
Subclass 7: Optical characteristic sensed

Class 700: Data Processing: Generic Control Systems Or Specific Applications

This class is structured into two main divisions: (1)for the combination of a data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) AND a device or apparatus controlled thereby, the entirety hereinafter referred to as a "control system". (2)for data processing or calculating computer apparatus (or corresponding methods for performing data processing or calculating operations) wherein the data processing or calculating computer apparatus is designed for or utilized in a particular art device, system, process, or environment, or is utilized for the solution of a particular problem in a field other than mathematics (arithmetic processing per se is classified elsewhere).

Subclass 121: Integrated circuit production or semiconductor fabrication