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- 2 Patent Applications - US
- 16 Issued Patents - US
- 1 Patent Application - CN
- 1 Issued Patent - JP
- 1 Issued Patent - KR
- 1 Patent Application - TW
Patent Portfolio for Sale:Manufacture Techniques for MEMS Structures and Optical Waveguides
- Bonding alternating conductive and glass layers with applicability in the formation of stacks for microcolumns in electron optics, including electron microscopes and lithography.
- Creation of micro electromechanical structures (MEMS), and micro opto-electromechanical structures (MOEMS).
- Techniques for removing particles from a surface by heating a fluid to form a vapor; applying the vapor to the surface so as to condense the vapor on the particles and coat the particles on the surface with a liquid; then applying a suction force after applying the vapor to remove the majority of the particles.
- Techniques for etching dielectric layers in semiconductor or MEMS via sequence of processing cycles that include: depositing an inactive polymeric film, activating the film to etch the structure, and the removal of the film.
- Plasma etching a pattern containing at least one deeply recessed feature which is etched to a depth of 5mum or more into a silicon-containing substrate, in a manner which generates smooth sidewalls.
- Techniques for depositing and monitoring layers used to form optical waveguides and method for forming an optical waveguide with undercladding and uppercladding layers deposited with a thermal CVD technique.
- Techniques for processing a film over a substrate in a process chamber; monitoring a parameter during processing of the film over a thickness greater than 3�m; and changing the process conditions in accordance with a correlation among a value of the parameter, an optical property of the film, and the process conditions.
Primary Application of the Technology
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Class 156: Adhesive Bonding And Miscellaneous Chemical Manufacture
This is the generic class for: Manufacturing processes and apparatus; manufacture of articles of commerce in which one of the manufacturing steps includes a chemical reaction; manufacture of panels from settable inorganic compositions; manufacture of electrical conductors of indefinite length.Subclass 272.2: With direct application of electrical, magnetic, or radiant energy to work
Subclass 273.9: Work constitutes conductor of electrical circuit
Subclass 274.4: Exposure of work to electrode
Subclass 345.11: For liquid etchant
Subclass 345.21: Liquid etchant spray type
Class 65: Glass Manufacturing
(1) processes and/or apparatus for making stock or articles of those ceramic masses, which generally include a "glass former" or an oxide which approaches glass forming properties, in their composition and which are formed by fusion of raw materials (generally mixtures, most of which are of an earthy nature - as distinguished from metallic, organic, etc., - silicon, silica, and slag are included) at ordinary high furnace temperatures, by working (molding, shaping, etc.) of the mass after being melted or changed to a plastic or softened state by heating; and (2) processes and/or apparatus for treating stock or articles madeSubclass 386: Planar waveguides
Subclass 59.1: Of glass to metal part
Class 438: Semiconductor Device Manufacturing: Process
This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.Subclass 106: PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR
Subclass 107: Assembly of plural semiconductive substrates each possessing electrical device
Subclass 108: Flip-chip-type assembly
Subclass 109: Stacked array (e.g., rectifier, etc.)
Subclass 216: Gate insulator structure constructed of diverse dielectrics (e.g., MNOS, etc.) or of nonsilicon compound
Subclass 477: By vapor phase surface reaction
Subclass 48: MAKING DEVICE OR CIRCUIT RESPONSIVE TO NONELECTRICAL SIGNAL
Subclass 50: Physical stress responsive
Subclass 52: Having cantilever element
Subclass 695: Simultaneous etching and coating
Subclass 700: Formation of groove or trench
Subclass 706: Vapor phase etching (i.e., dry etching)
Subclass 713: Forming tapered profile (e.g., tapered etching, etc.)
Subclass 714: Including change in etch influencing parameter (e.g., energizing power, etchant composition, temperature, etc.)
Subclass 719: Silicon
Subclass 723: Silicon oxide or glass
Subclass 725: Organic material (e.g., resist, etc.)
Subclass 734: Sequential etching steps on a single layer
Subclass 739: Lateral etching of intermediate layer (i.e., undercutting)
Subclass 745: Liquid phase etching
Subclass 752: Germanium
Subclass 753: Silicon
Subclass 756: Silicon oxide
Class 216: Etching A Substrate: Processes
Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.Subclass 103: Etchant contains acid
Subclass 107: Etchant contains fluoride ion
Subclass 2: ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION
Subclass 58: GAS PHASE ETCHING OF SUBSTRATE
Subclass 59: With measuring, testing, or inspecting
Subclass 73: Etching vapor produced by evaporation, boiling, or sublimation
Subclass 74: Etching inorganic substrate
Subclass 79: Etching silicon containing substrate
Subclass 90: Relative movement between the substrate and a confined pool of etchant
Subclass 91: Rotating, repeated dipping, or advancing movement of substrate
Subclass 99: Substrate contains silicon or silicon compound
Class 134: Cleaning And Liquid Contact With Solids
Cleaning, i.e., the separation or removal of adherent dirt, scale, tarnish, impurities or any other foreign or undesired matter from solid materials or objects whether or not the resultant separated ingredients are recovered in whole or in part for subsequent use. Cleaning may be performed by, or may involve as a part thereof, contacting solids with liquids. The contacting of solids with liquids may be for purposes other than cleaning.Subclass 1.3: Semiconductor cleaning
Subclass 3: Including acidic agent
Subclass 21: Including use of vacuum, suction, or inert atmosphere
Subclass 31: Gas or vapor condensation or absorption oowork
Subclass 34: With treating fluid motion
Subclass 37: Gas or vapor blasts or currents
Class 427: Coating Processes
This is the generic class for: A. applying or obtaining a coating on a surface. The coating may be hard or soft, permanent or transitory, supplied solely by extraneous materials or supplied wholly or in part by the base material. B. impregnating a base by causing a coating material to extend or penetrate into the base material, or into the interstices of a porous, cellular or foraminous material. C. taking preparatory treatments of the base material, subsequent treatments of the coated base material and other ancillary noncoating operations claimed, per se, processes limited to etching for making a base more compatible with, or adherent to, the coating wherein the base is the substrate (work) onto which a coating is applied are included.Subclass 212: PARTICLES, FLAKES, OR GRANULES COATED OR ENCAPSULATED
Subclass 240: CENTRIFUGAL FORCE UTILIZED
Subclass 350: Vacuum or reduced pressure utilized
Subclass 422: Heated coating material
Class 118: Coating Apparatus
pparatus for applying or obtaining a surface coating on a base and/or apparatus for impregnating base materials and takes all such apparatus not provided for in other classes. The coating obtained may be permanent or transitory. The coating may be supplied solely by extraneous materials, as in a painting or waxing operation, or may be supplied wholly or in part by the base materials as in the formation of an oxide coating on a metal base. The coating may consist of an emulsion, dispersion, solution, admixture or oil which is clearly disclosed as leaving a residual film, layer or continuous deposit on the base.Subclass 719: Multizone chamber
Subclass 722: With treating means (e.g., jarring)
Subclass 723R: By creating electric field (e.g., gas activation, plasma, etc.)
Class 445: Electric Lamp Or Space Discharge Component Or Device Manufacturing
This is the residual and generic class of process and apparatus for the manufacturing, fabrication, repair, salvage, assembly, disassembly or other treatment of an electric lamp, liquid crystal display device or an electric space discharge device which process or apparatus is not elsewhere classified.Subclass 24: Display or gas panel making
Subclass 25: With sealing
Class 428: Stock Material Or Miscellaneous Articles
This is the residual class for: 1. Stock material in the form of a structurally defined web, sheet, rod, strand, fiber, filament, cell, flake, particle not provided elsewhere. 2. Stock material in the form of a web, sheet, mass or layer which consists of or contains a structurally defined constituent or element. 3. A nonstructural laminate defined merely in terms of the composition of one or more layers. 4. An article of manufacture or an intermediate-article not provided for elsewhere. 5. A process for applying an impregnating material to a naturally solid product such as a wood beam, a sheet of leather or a stone, or for applying a coating to a base, and which process includes no significant method step.Subclass 426: Of quartz or glass
Subclass 428: Next to another silicon containing layer
Subclass 432: Next to metal or compound thereof
Subclass 446: Of silicon containing (not as silicon alloy)
Subclass 448: As intermediate layer
Class 429: Chemistry: Electrical Current Producing Apparatus, Product, And Process
This class is the generic class for devices which produce an electrical current by means of a chemical reaction or change in physical state (e.g., from liquid to gas, etc.). Also included are the following subject matter not provided for elsewhere. 1. Structural combinations of the device, subcombinations and elements thereof. 2. Electrolyte, compositions of the same, and process of preparation. 3. Process of operating the device. 4. Miscellaneous process involving the device.cataSubclass 149: Plural cells
Subclass 218.1: Chemically specified inorganic electrochemically active material containing
Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)
This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.Subclass E21.035: Characterized by their composition, e.g., multilayer masks, materials (EPO)
Subclass E21.252: By dry-etching (EPO)
Subclass E21.257: Using mask (EPO)
Class 385: Optical Waveguides
(1) An optical waveguiding element, which conveys light from one point to another through an optically transparent elongated structure by modal transmission, total internal reflection, or total reflectorization. (2) A combination of an optical waveguiding element with an additional broadly recited optical element which couples light or a combination. (3) A combination of an optical waveguiding element with structure which mechanically joins this waveguiding element with another or with a diverse optical element. (4) An optical modulator where the modulation of a light wave characteristic is performed exclusively within an optical waveguiding element. (5) Other miscellaneous devices formed of an optical waveguide (e.g., a waveguide sensing device) and supplemental devices which are limited to use with an optical waveguide (e.g., an external clamp or retainer).Subclass 129: PLANAR OPTICAL WAVEGUIDE
Subclass 131: Multilayer structure (mixture)
Class C23C4: CHEMISTRY; METALLURGY - COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMI. Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge .
Class C23C8: CHEMISTRY; METALLURGY - COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMI. Solid state diffusion of only non-metal elements into metallic material surfaces .
Class C23C16: CHEMISTRY; METALLURGY - COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMI. Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition .
Class G02B6: PHYSICS - OPTICS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS . Light guides.
Class H01J37: ELECTRICITY - BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS . Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof .