Patent Portfolio for Sale:

Semiconductor Chip & MEMs Manufacturing    

Overview

Inventions include manufacturing semiconductor chips plus micro-mirror optical devices including switches, attenuators, add-drop multiplexors and modulators, air bag accelerometers, pressure sensors etc.

Patent Summary

U.S. Patent Classes & Classifications Covered in this listing:

Class 359: Optical: Systems And Elements

Optical elements included in this class are: Lenses; Polarizers; Diffraction gratings; Prisms; Reflectors; Filters; Projection screens; Optical Modulators; Optical Demodulators. Among the optical systems included in this class are: Compound lens systems; Light reflecting signalling systems (e.g., retroreflectors); stereoscopic systems; Binocular devices; Systems of lenticular elements; Systems involving light interference; Glare reducing systems; Light dividing and combining systems; Light control systems (e.g., light valves); building illumination with natural light; Systems for protecting or shielding elements; Optical systems whose operation depends upon polarizing, diffracting, dispersing, reflecting, or refracting light; kaleidoscopes. Further included are certain apertures, closures, and viewing devices of a specialized nature which involve no intentional reflection, refraction, or filtering of light rays. This class also includes optical elements combined with another type of structure(s) to constitute an optical element combined with a nonoptical structure or a perfection or improvement in the optical element.

Subclass 290: By changing physical characteristics (e.g., shape, size or contours) of an optical element

Class 385: Optical Waveguides

(1) An optical waveguiding element, which conveys light from one point to another through an optically transparent elongated structure by modal transmission, total internal reflection, or total reflectorization. (2) A combination of an optical waveguiding element with an additional broadly recited optical element which couples light or a combination. (3) A combination of an optical waveguiding element with structure which mechanically joins this waveguiding element with another or with a diverse optical element. (4) An optical modulator where the modulation of a light wave characteristic is performed exclusively within an optical waveguiding element. (5) Other miscellaneous devices formed of an optical waveguide (e.g., a waveguide sensing device) and supplemental devices which are limited to use with an optical waveguide (e.g., an external clamp or retainer).

Subclass 16: Switch (i.e., switching from one terminal to another, not modulation)
Subclass 18: Reflective-type switch

Class 438: Semiconductor Device Manufacturing: Process

This class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.

Subclass 221: Dielectric isolation formed by grooving and refilling with dielectric material
Subclass 29: Including integrally formed optical element (e.g., reflective layer, luminescent material, contoured surface, etc.)
Subclass 421: Having air-gap dielectric (e.g., groove, etc.)
Subclass 48: MAKING DEVICE OR CIRCUIT RESPONSIVE TO NONELECTRICAL SIGNAL
Subclass 50: Physical stress responsive
Subclass 52: Having cantilever element
Subclass 719: Silicon
Subclass 735: Differential etching of semiconductor substrate
Subclass 739: Lateral etching of intermediate layer (i.e., undercutting)
Subclass 740: Utilizing etch stop layer
Subclass 745: Liquid phase etching
Subclass 756: Silicon oxide

Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)

This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.

Subclass 417: Strain sensors
Subclass 507: With single crystal insulating substrate (e.g., sapphire)
Subclass 510: Dielectric in groove
Subclass 513: Vertical walled groove
Subclass E21.027: Photolith ographic process (EPO)
Subclass E21.234: Characterized by their behavior during process, e.g., soluble mask, redeposited mask (EPO)
Subclass E21.257: Using mask (EPO)
Subclass E21.314: Using mask (EPO)

Class 398: Optical Communications

This class provides for all types of communication systems in which optical signals are used to transmit modulated carrier wave information between points. Such communication includes transmitting an intelligence-bearing signal from one point to another in the form of variations in a characteristic of the light wave. The communication may be through free space, fibers or waveguides. These are used to transfer the information with an optical beam, and this beam can be used in various communication schemes to enable the most effective or desired method of moving the information, including optical multiplexing when plural information signals or plural transmitters and receivers are utilized.

Subclass 164: Including optical circuit board

Class 216: Etching A Substrate: Processes

Chemical etching processes for treating articles of commerce or intermediate articles not otherwise provided for in which one of the manufacturing steps includes a chemical etching step (use of an etchant) and wherein the material treated is not completely removed.

Subclass 2: ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION
Subclass 79: Etching silicon containing substrate

Class 430: Radiation Imagery Chemistry: Process, Composition, Or Product Thereof

This is the generic class for: (1) Forming the likeness of an object, or an instrumented or discernible phenomenon, in a chemically defined receiver or in a receiver wherein radiation produces a chemical reaction, by use of radiation. (2) Finishing an image by chemical processing regardless how formed. (3) A radiation sensitive receiver, composition, or product disclosed solely for radiation imagery chemistry, and process of making same. (4) A nonradiation sensitive-receiver, composition, or product. (5) An imaged product by a process or employing a receiver, composition, or product.

Subclass 311: Making electrical device
Subclass 321: Optical device
Subclass 322: Forming nonplanar surface
Subclass 323: Including etching substrate