Patent Portfolio for Sale:Private Listing: Number 1616
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Class 438: Semiconductor Device Manufacturing: ProcessThis class provides for manufacturing a semiconductor containing a solid-state device for the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. Also operations involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing a semiconductive region. It also provides for operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region. The class provides for packaging or treatment of packaged semiconductor.
Subclass 612: Forming solder contact or bonding pad
Subclass 613: Bump electrode
Subclass 614: Plural conductive layers
Subclass 615: Including fusion of conductor
Class 257: Active Solid-State Devices (E.G., Transistors, Solid-State Diodes)This class provides for active solid-state electronic devices, that is, electronic devices or components that are made up primarily of solid materials, usually semiconductors, which operate by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action, and are not classified elsewhere.
Subclass 737: Bump leads
Subclass 738: Ball shaped
Subclass 741: Of specified material other than unalloyed aluminum
Subclass E21.309: By liquid etching only (EPO)
Subclass E21.503: Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)
Subclass E21.508: Forming solder bumps (EPO)
Subclass E21.511: Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)
Subclass E23.069: Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)
Subclass E23.021: Bump or ball contacts (EPO)
Subclass E23.023: Consisting of soldered or bonded constructions (EPO)
Subclass 751: At least one layer forms a diffusion barrier
Subclass 753: With adhesion promoting means (e.g., layer of material) to promote adhesion of contact to an insulating layer
Subclass 766: At least one layer containing chromium or nickel
Subclass 778: Flip chip
Subclass 779: Solder wettable contact, lead, or bond
Subclass 780: Ball or nail head type contact, lead, or bond
Class 428: Stock Material Or Miscellaneous ArticlesThis is the residual class for: 1. Stock material in the form of a structurally defined web, sheet, rod, strand, fiber, filament, cell, flake, particle not provided elsewhere. 2. Stock material in the form of a web, sheet, mass or layer which consists of or contains a structurally defined constituent or element. 3. A nonstructural laminate defined merely in terms of the composition of one or more layers. 4. An article of manufacture or an intermediate-article not provided for elsewhere. 5. A process for applying an impregnating material to a naturally solid product such as a wood beam, a sheet of leather or a stone, or for applying a coating to a base, and which process includes no significant method step.
Subclass 646: Sn-base component
Subclass 647: Next to Group IB metal-base component
Subclass 648: Next to Group VIII metal-base component
Class 228: Metal Fusion BondingMethod of joining the meeting faces of juxtaposed or engaged metal work parts or of the same part originally in a form-sustaining state, by the direct application of heat and/or mechanical energy to either of: (a) such work parts, to such an extent as to effect a flowing or blending together of some of the metal in neighboring regions of said work parts into a continuous metallic zone interconnecting said work parts, or (b) such work parts and a metallic filler, to such an extent as to effect a flowing or blending together of the filler and some of the metal of said work portions into a continuous metallic zone interconnecting said work portions with filler and thus with each other.
Subclass 179.1: Of electrical device (e.g., semiconductor)
Subclass 180.1: Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards)
Subclass 180.21: Component terminal to substrate surface (i.e., nonpenetrating terminal)
Subclass 180.22: Lead-less (or bumped) device
Subclass 248.1: Applied in powdered or particulate form
Class 420: Alloys Or Metallic CompositionsThis is the generic class for alloys containing metal or metallic compositions which contain a continuous phase of metal and methods of making same not provided elsewhere. This class will also take "elemental" metal, per se.
Subclass 557: TIN BASE
Subclass 560: Copper containing
Subclass 561: Antimony, or bismuth containing
Subclass 562: Antimony, or bismuth containing
Class 29: Metal WorkingMetal working or shaping - it comprises processes, tools, machines, and apparatus not classifiable in the specific classes relating to the manufacture of articles from metal. It has been made the generic class for the following regardless of the composition of the blank, stock material, or article recited or worked upon: (a) process of electric condenser making; (b) a burnishing process; (c) a process of manufacture; (d) apparatus used to assemble or disassemble.
Subclass 840: By metal fusion
Class 148: Metal TreatmentTreating metal to modify or maintain the internal physical structure or chemical properties of metal. Most processes in this class relate to treating solid or semisolid metal with heat, without melting a substantial portion thereof, and also includes the combination of significant heating and working not provided for in other metal working classes. Cooling of metal to produce microstructure change is proper for this class. It includes processes of treating metal to intentionally develop, improve, modify, or preserve the magnetic properties of a free metal or alloy, occurring alone or mixed with one or more components. Also included are processes of reactive coating of metal wherein an externally supplied carburizing or nitriding agent is combined with the metal substrate to produce a carburized or nitridized or carbonitrided coating thereon or a uniformly carburized, nitrided, or carbonitrided metal alloy containing a metal element from said substrate.
Subclass 24: Metallic
Subclass 400: STOCK
Class 75: Specialized Metallurgical Processes, Compositions For Use Therein, Consolidated Metal Powder Compositions, And Loose Metal Particulate MixturesSpecialized metallurgical processes for producing or recovering metals from metal compounds, ores, or scrap metal and for refining liquid metal and for compositions used in these specialized metallurgical processes, consolidated metal powder compositions, and loose metal particulate mixtures.
Subclass 255: Loose particulate mixture (i.e., composition) containing metal particles
Class 205: Electrolysis: Processes, Compositions Used Therein, And Methods Of Preparing The CompositionsProcesses (1) involving the use of electrolysis (2) of preparing or purifying compounds or elements involving chemical reaction brought about by electrical or wave energy in a magnetic field; (3) of treating materials involving chemical reaction brought about by wave energy; (4) of preparing or purifying compounds or elements involving chemical reaction brought about by an electrostatic field or electrical discharge; (5) involving the use of electrophoresis or electro-osmosis; (6) of treating a liquid (a) to separate or purify the liquid using electric and magnetic fields simultaneously, (b) to separate or purify the liquid using an electric field, or (c) using a magnetic field to obtain some effect other than mere separation or purification of the liquid; (7) involving coating, forming, or etching by the use of sputtering; and (8) involving coating by the use of vacuum arc discharge. Electrolyte compositions specialized for use in electrolytic processes or methods of preparing the compositions.
Subclass 682: Phosphorus containing
Subclass 684: Organic material containing
Class 174: Electricity: Conductors And InsulatorsThis class is for inventions relating to the structure of electrical conductors and insulators and insulators and the apparatus specialized to mounting, supporting, encasing in conduits, and/or housing the same. Conductors may be bare or be encased in insulation, may be single strand or plural strand, may be of single conductor form or there may be a plurality of conductors associated together to form a cable. Since all materials that have the property of being conductors of electricity and all devices made therefrom may be termed electrical conductors, only those structures that are specially designed to conduct electricity as their proximate purpose are placed in this class. Insulators are placed here when the structure thereof is claimed, which structure is specially designed for spacing two or more devices of different electrical potential from each other or for spacing one or more devices from ground. Since all materials which are poor conductors of electricity and devices made therefrom may be termed electrical insulators, only those structures whose proximate purpose is that already stated. Conduits are placed in this class only when some characteristic is claimed which limits the same to the electrical use.
Subclass 541: Connection