Patent for License:Equipment for Manufacturing Semiconductor
Comments on Deal Structure, Potential Terms and Restrictions
Class 204: Chemistry: Electrical And Wave Energy
This class includes, where not provided for elsewhere: A. Processes (1) involving the use of electrolysis (as provided for in Class 205); (2) of preparing or purifying compounds or elements involving chemical reaction brought about by electrical or wave energy in a magnetic field; (3) of treating materials involving chemical reaction brought about by wave energy; (4) of preparing or purifying compounds or elements involving chemical reaction brought about by an electrostatic field or electrical discharge; (5) involving the use of electrophoresis or electro-osmosis; (6) of treating a liquid (a) to separate or purify the liquid using electric and magnetic fields simultaneously, (b) to separate or purify the liquid using an electric field, or (c) using a magnetic field to obtain some effect other than mere separation or purification of the liquid; (7) involving coating, forming, or etching by the use of sputtering; and (8) involving coating by the use of vacuum arc discharge.Subclass 192.1: Coating, forming or etching by sputtering
Subclass 192.12: Glow discharge sputter deposition (e.g., cathode sputtering, etc.)
Subclass 192.15: Specified deposition material or use
Subclass 298.05: Ion plating
Subclass 298.06: Triode, tetrode, auxiliary electrode or biased workpiece
Subclass 298.12: Specified target particulars
Class C23C14: CHEMISTRY; METALLURGY - COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMI. Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material .
Class H01L51: ELECTRICITY - BASIC ELECTRIC ELEMENTS
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR . Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts the.