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Optics : Solid State

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Patents & Technology Available

Number of Technology Available listing in this topic: 323

LED Die & Array Lens Packaging
For Solid State LED Lighting & Lamps  > view
Printed Circuit Boards
EMC reduction, impedance control of highspeed signals, board connectors solutions and assemblies, etc.  > view
Digital convergence portfolio
Significant portfolio covering digital audio, video, hardware, imaging processing and electronic circuitry  > view
OLED Patent Portfolio
Stable long life luminescent polymers that can efficiently emit light at a low voltage   > view
Semiconductor Fabrication Portfolio
Portfolio of semiconductor fabrication processes  > view
Semiconductor Device - Memory
6 U.S. Patents relating to memory  > view
Semiconductor Wafer Immersion Cleaning
Technologies comprising complete immersive wafer cleaning systems and compelling new product line opportunity.  > view
Multi-Beam Patent Portfolio for Accurate High-Speed Placement and Overlay
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ...  > view
Manufacture Techniques for MEMS Structures
International patent portfolio covers manufacturing methods for various MEMS structures with broad range of applications.   > view
Optical Clocking For High-Speed Chips
Ultimate precision in microprocessor clocking.  > view
Photonics Signaling for Highspeed Chip Communication, Clocking and Synchronization
Highly innovative inventions to integrate optical signals in a chip with minimal disruption to current manufacturing process which will improve performance and reduce ...  > view
Heat Sink Technology
Eight granted U.S. patents  > view
Multiple Electron-Beam Writing to Mask and Wafer
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ...  > view
Ink-Jet Printing Nozzle
Patented technique for manufacture of precise ink-jet printer nozzles  > view
Semiconductor Packaging
Fluid filling wafer level packaging cavities  > view
Reclaiming Wafer Substrates that have Defects and Contaminants
System and methodology for improving incoming and outgoing wafer inspection productivity in a wafer reclaim environment  > view
Electronics Packaging
ICs, Power Transistors, Sensors & Module packaging plus Circuit board enclosures  > view