Optics : Solid State

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Patents & Technology Available

Number of Technology Available listing in this topic: 317

Simplified Illuminated Display Case using LED's and Refaction Panel
Display case design that allows manufacturers to use standard picture frame profiles or insert the base into an existing light box  > view
LED Die & Array Lens Packaging
For Solid State LED Lighting & Lamps  > view
Printed Circuit Boards
EMC reduction, impedance control of highspeed signals, board connectors solutions and assemblies, etc.  > view
Digital convergence portfolio
Significant portfolio covering digital audio, video, hardware, imaging processing and electronic circuitry  > view
OLED Patent Portfolio
Stable long life luminescent polymers that can efficiently emit light at a low voltage   > view
Semiconductor Fabrication Portfolio
Portfolio of semiconductor fabrication processes  > view
Semiconductor Device - Memory
6 U.S. Patents relating to memory  > view
Semiconductor Wafer Immersion Cleaning
Technologies comprising complete immersive wafer cleaning systems and compelling new product line opportunity.  > view
Multi-Beam Patent Portfolio for Accurate High-Speed Placement and Overlay
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ...  > view
Manufacture Techniques for MEMS Structures
International patent portfolio covers manufacturing methods for various MEMS structures with broad range of applications.   > view
Optical Clocking For High-Speed Chips
Ultimate precision in microprocessor clocking.  > view
Photonics Signaling for Highspeed Chip Communication, Clocking and Synchronization
Highly innovative inventions to integrate optical signals in a chip with minimal disruption to current manufacturing process which will improve performance and reduce ...  > view
Heat Sink Technology
Eight granted U.S. patents  > view
Ink-Jet Printing Nozzle
Patented technique for manufacture of precise ink-jet printer nozzles  > view
Semiconductor Packaging
Fluid filling wafer level packaging cavities  > view
Reclaiming Wafer Substrates that have Defects and Contaminants
System and methodology for improving incoming and outgoing wafer inspection productivity in a wafer reclaim environment  > view
Electronics Packaging
ICs, Power Transistors, Sensors & Module packaging plus Circuit board enclosures  > view