Global Patent Exchange
Electronic Engineering : Integrated CircuitsSign up for an email alert when new listing are posted, or subscribe to our RSS feed.
Can’t find what you are looking for? Create your own topic - register for a Tynax Account, and Create a Saved Search.
Email Alert
RSSPatents & Technology Available
Number of Technology Available listing in this topic: 413
Semiconductor Wafer Immersion Cleaning
Technologies comprising complete immersive wafer cleaning systems and compelling new product line opportunity. > view
Technologies comprising complete immersive wafer cleaning systems and compelling new product line opportunity. > view
Multi-Beam Patent Portfolio for Accurate High-Speed Placement and Overlay
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ... > view
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ... > view
Manufacture Techniques for MEMS Structures
International patent portfolio covers manufacturing methods for various MEMS structures with broad range of applications. > view
International patent portfolio covers manufacturing methods for various MEMS structures with broad range of applications. > view
Photonics Signaling for Highspeed Chip Communication, Clocking and Synchronization
Highly innovative inventions to integrate optical signals in a chip with minimal disruption to current manufacturing process which will improve performance and reduce ... > view
Highly innovative inventions to integrate optical signals in a chip with minimal disruption to current manufacturing process which will improve performance and reduce ... > view
Multiple Electron-Beam Writing to Mask and Wafer
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ... > view
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ... > view
Telecommunications Portfolio
Telecommunications patents relating to networks, pbx, video conferencing, and text-to-scene conversion > view
Telecommunications patents relating to networks, pbx, video conferencing, and text-to-scene conversion > view
Use of electronic components in via-holes of a multi-layer multi-chip module
A method for embedding electronic components inside via-holes of a multi-layer multi-chip module thus creating high densty, three dimensional electronic package. > view
A method for embedding electronic components inside via-holes of a multi-layer multi-chip module thus creating high densty, three dimensional electronic package. > view
Optical Disk Technology
These patents cover some of key area for DVD system including one Digital TV patent. > view
These patents cover some of key area for DVD system including one Digital TV patent. > view
EDA Tools - VLIW
Electronic design automation for very large instruction word processor design. > view
Electronic design automation for very large instruction word processor design. > view
Reclaiming Wafer Substrates that have Defects and Contaminants
System and methodology for improving incoming and outgoing wafer inspection productivity in a wafer reclaim environment > view
System and methodology for improving incoming and outgoing wafer inspection productivity in a wafer reclaim environment > view
Electronics Packaging
ICs, Power Transistors, Sensors & Module packaging plus Circuit board enclosures > view
ICs, Power Transistors, Sensors & Module packaging plus Circuit board enclosures > view