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Number of Technology Available listing in this topic: 380
Semiconductor Wafer Processing Chamber Patents
Patent portfolio covering key aspects of semiconductor manufacturing and chamber technologies > view
Patent portfolio covering key aspects of semiconductor manufacturing and chamber technologies > view
EDA and Integrated Circuit Design
EDA design methods, simulation and test of integrated circuits. > view
EDA design methods, simulation and test of integrated circuits. > view
Printed Circuit Boards
EMC reduction, impedance control of highspeed signals, board connectors solutions and assemblies, etc. > view
EMC reduction, impedance control of highspeed signals, board connectors solutions and assemblies, etc. > view
Digital convergence portfolio
Significant portfolio covering digital audio, video, hardware, imaging processing and electronic circuitry > view
Significant portfolio covering digital audio, video, hardware, imaging processing and electronic circuitry > view
Patent portfolio covering mobile phone components
Portfolio covering antennas, EMI shielding, connectors > view
Portfolio covering antennas, EMI shielding, connectors > view
Semiconductor Manufacturing Patent Portfolio
Portfolio covers elements such as etch, sensors and interconnects > view
Portfolio covers elements such as etch, sensors and interconnects > view
Inkjet Patents and Technologies for Low-Cost Display Manufacture & Other Applications
High-precision inkjet patents and technologies from World-class R&D group. > view
High-precision inkjet patents and technologies from World-class R&D group. > view
Semiconductor Wafer Immersion Cleaning
Technologies comprising complete immersive wafer cleaning systems and compelling new product line opportunity. > view
Technologies comprising complete immersive wafer cleaning systems and compelling new product line opportunity. > view
Manufacture Techniques for MEMS Structures
International patent portfolio covers manufacturing methods for various MEMS structures with broad range of applications. > view
International patent portfolio covers manufacturing methods for various MEMS structures with broad range of applications. > view
Photonics Signaling for Highspeed Chip Communication, Clocking and Synchronization
Highly innovative inventions to integrate optical signals in a chip with minimal disruption to current manufacturing process which will improve performance and reduce ... > view
Highly innovative inventions to integrate optical signals in a chip with minimal disruption to current manufacturing process which will improve performance and reduce ... > view
Multiple Electron-Beam Writing to Mask and Wafer
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ... > view
Field-proven technologies for correcting critical dimension errors including uniformity and linearity errors arising from multiple sources with an emphasis on real-time computations during ... > view
Telecommunications Portfolio
Telecommunications patents relating to networks, pbx, video conferencing, and text-to-scene conversion > view
Telecommunications patents relating to networks, pbx, video conferencing, and text-to-scene conversion > view