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Looking for the whole set technology of 12-inch wafer products, whole set technology of super-thin wafer, multi-layer laying off transfer technology, fine circuit making technology, micro-diagram galvanization technology, close-space ball attachment technology, stroke stress analysis and control technology, products reliability analysis and test analysis, etc. so as to achieve a circuit transfer structure over 2 layers, realize 5 micron wide and 5 micron space precision circuit and diagram as well as 200 micron welding ball diameter ball attachment, etc. |
