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Looking for close-space welding wire technology, super-thin wafer thickness reduction technology, multi-layer chip stacking technology, super-low arc welding wire technology, joint welding wire technology between chips, thin film packing processing technology, super-thin big size chip mounting technology, path control welding wire technology, super-thin plastic package technology, small size ball attachment technology in close-space, stroke stress analysis and control technology, products reliability analysis and test analysis, so as to achieve wafer of 50 microns thickness to the minimum, stacking structure over 5 levels, realize welding discs of 50 micron space and arc height welding wire of 50 microns, etc. |
