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Aiming at the development bottleneck of integrated circuits, we are looking for high-density micro-pore forming technology, micro-pore conduction technology, fine circuit fabrication technology, embedded hole filling technology, stroke stress analysis and control technology, substrate reliability analysis and test analysis, etc. The purpose is to obtain the micro-pore reach 50-100 micron as minimum, micro-pore can be filled flat, fine circuit making under 50 microns, core technology and key processing of super-thin medium layer under 50 microns and realize the industrialization of high density joint super-thin substrate. |
